公开(公告)号：US20180166313A1

公开(公告)日：2018-06-14

申请号：US15376042

申请日：2016-12-12

Applicant: Intel Corporation

Inventor： Mingzhi Dai ,  Wen Yin ,  Craig S. Dunning ,  Robert D. Callan

IPC: H01L21/683 ,  H01L23/00

CPC classification number: H01L21/6836 ,  H01L21/6835 ,  H01L24/83 ,  H01L24/93 ,  H01L2221/68313

Abstract: Embodiments relate to a carrier tape that includes a first layer of thermoplastic elastomer (TPE) adhesive tape. The carrier tape may further include a second layer of rigid polymer with a cavity. The rigid polymer may be coupled with a surface of the TPE adhesive tape such that the TPE adhesive tape is exposed by the cavity. A die may be coupled with the TPE adhesive tape within the cavity. Other embodiments may be described and/or claimed.