专利检索 ap:("Intel Corporation") AND inv:"SREENIDHI A. KOTI" 第 1 页

1.

发明申请
DUAL FORM FACTOR DEVICES HAVING OPERATIVE AND COMPLEMENTARY ALIGNING COMPONENTS 审中-公开

公开(公告)号：US20190246022A1

公开(公告)日：2019-08-08

申请号：US16358532

申请日：2019-03-19

申请人： Intel Corporation

发明人： NISHANTH RAMAPRAKASH , PRASANNA KRISHNASWAMY , SREENIDHI A. KOTI , ARVIND S

IPC分类号： H04N5/225 , G02B7/10 , G02B26/00 , G02B26/02 , H04N5/247

CPC分类号： H04N5/2257 , G02B7/102 , G02B26/007 , G02B26/023 , H04N5/2256 , H04N5/247

摘要： Embodiments relate to mobile devices and systems having an operative component integrated into a first housing and a complementary component within an opening of a second housing moveably coupled to the first housing such that, in a particular configuration of the device or system, the operative component is aligned with the complementary component to enhance performance of the operative component.

2.

发明申请
DUAL FORM FACTOR DEVICES HAVING OPERATIVE AND COMPLEMENTARY ALIGNING COMPONENTS 审中-公开

公开(公告)号：US20180255219A1

公开(公告)日：2018-09-06

申请号：US15874675

申请日：2018-01-18

申请人： Intel Corporation

发明人： NISHANTH RAMAPRAKASH , PRASANNA KRISHNASWAMY , SREENIDHI A. KOTI , ARVIND S

IPC分类号： H04N5/225 , H04N5/247 , G02B7/10

CPC分类号： H04N5/2257 , G02B7/102 , H04N5/2256 , H04N5/247

摘要： Embodiments relate to mobile devices and systems having an operative component integrated into a first housing and a complementary component within an opening of a second housing moveably coupled to the first housing such that, in a particular configuration of the device or system, the operative component is aligned with the complementary component to enhance performance of the operative component.