公开(公告)号：US20200373081A1

公开(公告)日：2020-11-26

申请号：US16989729

申请日：2020-08-10

Applicant: Intel Corporation

Inventor： Ranjul Balakrishnan ,  Sagar Dubey ,  Jackson Chung Peng Kong ,  Anil Baby

IPC: H01F27/36 ,  H01F27/24 ,  H01F27/02 ,  H01F41/00 ,  H05K1/18 ,  H05K1/02

Abstract: Embodiments of the present disclosure may relate to forming a metal shield around a molded ferrite inductor to reduce the electromagnetic energy radiated by the inductor during operation. The metal shield allows an inductor to be placed on a PCB with multiple signal routing layers below and close to the inductor, as well as micro strips on the surface of the PCB close to the inductor, to reliably route signals during operation. Other embodiments may be described and/or claimed.