公开(公告)号：US20220015246A1

公开(公告)日：2022-01-13

申请号：US17482356

申请日：2021-09-22

Applicant: Intel Corporation

Inventor： Ranjul Balakrishnan ,  Sandesh G. Krishnamurthy ,  Jackson C.P. Kong

IPC: H05K3/46 ,  H05K1/11 ,  H05K3/00 ,  H05K1/18

Abstract: Technologies for shielding an inductor on a circuit board are disclosed. In the illustrative embodiments, a circuit board has a voltage regulator on top of it and one or more signal traces routed beneath or near the voltage regulator. Partial metal vias are positioned between the signal traces and the voltage regulator. The partial metal vias extend from one trace layer of a circuit board towards another trace layer, but the partial metal vias do not connect the two trace layers. The partial metal vias partially shield the signal traces from noise caused by the voltage regulator.