公开(公告)号：US10404309B2

公开(公告)日：2019-09-03

申请号：US15278799

申请日：2016-09-28

Applicant: Intel Corporation

Inventor： Sankarananda Basak ,  Joshua Een ,  David W. Browning

IPC: H04M1/00 ,  H04B1/3888 ,  H04M1/02

Abstract: A mobile device may include circuitry, a thermally-conductive panel in thermal communication with the circuitry, and a housing with a user-operable thermal access cover that has a closed position to cover the thermally-conductive panel and an open position to expose the thermally-conductive panel. Embodiments may include a dock with which the mobile device may be engaged, wherein the dock may include a thermal transfer device to engage the thermally-conductive panel of the mobile device.

公开(公告)号：US20180091183A1

公开(公告)日：2018-03-29

申请号：US15278799

申请日：2016-09-28

Applicant: Intel Corporation

Inventor： Sankarananda Basak ,  Joshua Een ,  David W. Browning

IPC: H04B1/3888 ,  H04M1/02

CPC classification number: H04B1/3888 ,  H04M1/0202 ,  H04M1/0235

Abstract: A mobile device may include circuitry, a thermally-conductive panel in thermal communication with the circuitry, and a housing with a user-operable thermal access cover that has a closed position to cover the thermally-conductive panel and an open position to expose the thermally-conductive panel. Embodiments may include a dock with which the mobile device may be engaged, wherein the dock may include a thermal transfer device to engage the thermally-conductive panel of the mobile device.