公开(公告)号：US20210194106A1

公开(公告)日：2021-06-24

申请号：US17194022

申请日：2021-03-05

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Sasha OSTER ,  Georgios DOGIAMIS ,  Johanna SWAN

IPC: H01P5/08 ,  H01P1/207 ,  H01P3/12

Abstract: Embodiments of the invention include a mm-wave waveguide connector and methods of forming such devices. In an embodiment the mm-wave waveguide connector may include a plurality of mm-wave launcher portions, and a plurality of ridge based mm-wave filter portions each communicatively coupled to one of the mm-wave launcher portions. In an embodiment, the ridge based mm-wave filter portions each include a plurality of protrusions that define one or more resonant cavities. Additional embodiments may include a multiplexer portion communicatively coupled to the plurality of ridge based mm-wave filter portions and communicative coupled to a mm-wave waveguide bundle. In an embodiment the plurality of protrusions define resonant cavities with openings between 0.5 mm and 2.0 mm, the plurality of protrusions are spaced apart from each other by a spacing between 0.5 mm and 2.0 mm, and wherein the plurality of protrusions have a thickness between 200 μm and 1,000 μm.

公开(公告)号：US20200168972A1

公开(公告)日：2020-05-28

申请号：US16613070

申请日：2017-07-01

Applicant: Intel Corporation

Inventor： Georgios DOGIAMIS ,  Sasha OSTER ,  Telesphor KAMGAING ,  Erich EWY ,  Kenneth SHOEMAKER ,  Adel ELSHERBINI ,  Johanna SWAN

IPC: H01P3/16 ,  B60W40/02 ,  B60R16/023 ,  B60R11/04

Abstract: Embodiments of the invention include autonomous vehicles and mm-wave systems for communication between components. In an embodiment the vehicle includes an electronic control unit (ECU). The ECU may include a printed circuit board (PCB) and a CPU die packaged on a CPU packaging substrate. In an embodiment, the CPU packaging substrate is electrically coupled to the PCB. The ECU may also include an external predefined interface electrically coupled to the CPU die. In an embodiment, an active mm-wave interconnect may include a dielectric waveguide, and a first connector coupled to a first end of the dielectric waveguide. In an embodiment, the first connector comprises a first mm-wave engine, and the first connector is electrically coupled to the external predefined interface. Embodiments may also include a second connector coupled to a second end of the dielectric waveguide, wherein the second connector comprises a second mm-wave engine.

公开(公告)号：US20200076040A1

公开(公告)日：2020-03-05

申请号：US16613386

申请日：2017-07-01

Applicant: Intel Corporation

Inventor： Georgios DOGIAMIS ,  Sasha OSTER ,  Telesphor KAMGAING ,  Erich EWY ,  Adel ELSHERBINI ,  Johanna SWAN

IPC: H01P5/02 ,  H01P3/16 ,  H05K5/02 ,  H05K5/00 ,  H05K1/18 ,  H01L25/18 ,  H01L23/66 ,  H01R13/646 ,  H01R13/622 ,  H01R13/631 ,  B60R16/023

Abstract: Embodiments of the invention include dielectric waveguides and connectors for dielectric waveguides. In an embodiment a dielectric waveguide connector may include an outer ring and one or more posts extending from the outer ring towards the center of the outer ring. In some embodiments, a first dielectric waveguide secured within the dielectric ring by the one or more posts. In another embodiment, an enclosure surrounding electronic components may include an enclosure wall having an interior surface and an exterior surface and a dielectric waveguide embedded within the enclosure wall. In an embodiment, a first end of the dielectric waveguide is substantially coplanar with the interior surface of the enclosure wall and a second end of the dielectric waveguide is substantially coplanar with the exterior surface of the enclosure wall.