公开(公告)号：US20230408581A1

公开(公告)日：2023-12-21

申请号：US17841391

申请日：2022-06-15

Applicant: Intel Corporation

Inventor： Rakesh Kandula ,  Sankaran Menon ,  Seng Choon Thor ,  Shivaprashant Bulusu ,  Eswar Vadlamani ,  Ramakrishnan Venkatasubramanian

IPC: G01R31/3185

CPC classification number: G01R31/318536 ,  G01R31/318544 ,  G01R31/318555 ,  G01R31/318572

Abstract: Techniques for interface conversion and unicast for test content, firmware, and software delivery are described. An example apparatus comprises a scan test interface coupled to multiple circuits blocks to perform a scan test for the multiple circuit blocks, and circuitry coupled to input/output (IO) signals of the scan test interface to provide content for the multiple circuit blocks and to deliver a replicated content to multiple endpoints of the multiple circuit blocks (e.g., unicast technology). In another example, the circuitry is coupled to the IO signals of the scan test interface and a system/communication interface to decode packets received at the IO signals and convert the decoded packets to provide content through the system/communication interface for the multiple circuit blocks. Other examples are described and claimed.