公开(公告)号：US20200076046A1

公开(公告)日：2020-03-05

申请号：US16122609

申请日：2018-09-05

Applicant: Intel Corporation

Inventor： Omkar KARHADE ,  William J. LAMBERT ,  Xiaoqian LI ,  Sidharth DALMIA

IPC: H01Q1/02 ,  H01Q1/22 ,  H03F3/24 ,  H03F3/195

Abstract: Embodiments include an electronic package that includes a radio frequency (RF) front end. In an embodiment, the RF front end may comprise a package substrate and a first die attached to a first surface of the package substrate. In an embodiment, the first die may include CMOS components. In an embodiment, the RF front end may further comprise a second die attached to the first surface of the package substrate. In an embodiment, the second die may comprise amplification circuitry. In an embodiment, the RF front end may further comprise an antenna attached to a second surface of the package substrate. In an embodiment, the second surface is opposite from the first surface.