公开(公告)号：US20180182736A1

公开(公告)日：2018-06-28

申请号：US15388906

申请日：2016-12-22

Applicant: Intel Corporation

Inventor： Feras Eid ,  Nader N. Abazarnia ,  Johanna M. Swan ,  Taesha D. Beasley ,  Sasha N. Oster ,  Tannaz Harirchian ,  Shawna M. Liff

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/373 ,  H01L23/29 ,  H01L23/48 ,  H01L23/498 ,  H01L21/56

Abstract: An embodiment includes an apparatus comprising: a semiconductor die; package molding that is molded onto and conformal with a first die surface of the semiconductor die and at least two sidewalls of the semiconductor die, the package molding including: (a)(i) a first surface contacting the semiconductor die, (a)(ii) a second surface opposite the first surface, and (a)(iii) an aperture that extends from the first surface to the second surface; and a polymer substantially filling the aperture; wherein the package molding includes a first thermal conductivity (watts per meter kelvin (W/(m·K)) and the polymer includes a second thermal conductivity that is greater than the first thermal conductivity. Other embodiments are described herein.

公开(公告)号：US10424559B2

公开(公告)日：2019-09-24

申请号：US15388906

申请日：2016-12-22

Applicant: Intel Corporation

Inventor： Feras Eid ,  Nader N. Abazarnia ,  Johanna M. Swan ,  Taesha D. Beasley ,  Sasha N. Oster ,  Tannaz Harirchian ,  Shawna M. Liff

IPC: H01L25/065 ,  H01L23/373 ,  H01L23/48 ,  H01L23/498 ,  H01L21/56 ,  H01L23/367 ,  H01L23/31 ,  H01L23/00

Abstract: An embodiment includes an apparatus comprising: a semiconductor die; package molding that is molded onto and conformal with a first die surface of the semiconductor die and at least two sidewalls of the semiconductor die, the package molding including: (a)(i) a first surface contacting the semiconductor die, (a)(ii) a second surface opposite the first surface, and (a)(iii) an aperture that extends from the first surface to the second surface; and a polymer substantially filling the aperture; wherein the package molding includes a first thermal conductivity (watts per meter kelvin (W/(m·K)) and the polymer includes a second thermal conductivity that is greater than the first thermal conductivity. Other embodiments are described herein.