公开(公告)号：US10367251B2

公开(公告)日：2019-07-30

申请号：US14757386

申请日：2015-12-23

Applicant: Intel Corporation

Inventor： Huan-Sheng Hwang ,  Thomas Liu ,  Aycan Erentok

IPC: H01Q1/27 ,  H01Q13/18 ,  H01Q21/30

Abstract: Various systems and methods for radiating RF transmissions outside of a portable electronic device with a conductive case. In an embodiment, this solution includes a conductive enclosure, a circuit board within the conductive enclosure, at least one non-conductive gap between the circuit board and the conductive enclosure, and a radio frequency (RF) connection between the circuit board and the conductive enclosure. The combination of enclosure and gaps can excite certain radiation modes at high frequency bands, such as a cavity-backed lambda-long slot radiation mode.

公开(公告)号：US20170187096A1

公开(公告)日：2017-06-29

申请号：US14757386

申请日：2015-12-23

Applicant: Intel Corporation

Inventor： Huan-Sheng Hwang ,  Thomas Liu ,  Aycan Erentok

IPC: H01Q1/24 ,  H01Q13/10

CPC classification number: H01Q1/273 ,  H01Q13/18 ,  H01Q21/30

Abstract: Various systems and methods for radiating RF transmissions outside of a portable electronic device with a conductive case. In an embodiment, this solution includes a conductive enclosure, a circuit board within the conductive enclosure, at least one non-conductive gap between the circuit board and the conductive enclosure, and a radio frequency (RF) connection between the circuit board and the conductive enclosure. The combination of enclosure and gaps can excite certain radiation modes at high frequency bands, such as a cavity-backed lambda-long slot radiation mode.