公开(公告)号：US20230314850A1

公开(公告)日：2023-10-05

申请号：US17710716

申请日：2022-03-31

Applicant: Intel Corporation

Inventor： Chia-Pin CHIU ,  Kaveh HOSSEINI ,  Omkar KARHADE ,  Tim Tri HOANG

IPC: G02F1/01 ,  G02B6/293

CPC classification number: G02F1/0147 ,  G02B6/29395 ,  G02F2203/15 ,  G02B6/2934

Abstract: Embodiments disclosed herein include an on-cavity photonic integrated circuit (OCPIC). In an embodiment, the OCPIC comprises a laser transmitter, that comprises a row with four bumps, and a micro-ring resonator (MRR) in the row between a first bump and a second bump of the four bumps. In an embodiment, a cavity is below the MRR, where a diameter of the cavity is substantially equal to a spacing between the first bump and the second bump.

公开(公告)号：US20230314704A1

公开(公告)日：2023-10-05

申请号：US17710709

申请日：2022-03-31

Applicant: Intel Corporation

Inventor： Chia-Pin CHIU ,  Kaveh HOSSEINI ,  Omkar KARHADE ,  Tim Tri HOANG

IPC: G02B6/12 ,  H01L25/16

CPC classification number: G02B6/12007 ,  H01L25/167 ,  G02B6/29338

Abstract: Embodiments disclosed herein include an optoelectronic system. In an embodiment, the optoelectronic system comprises a first substrate, a second substrate over the first substrate, and a micro-ring resonator (MRR) over the second substrate. In an embodiment, a heater is integrated into the MRR, a cladding is over the MRR, and a temperature sensor is over the MRR in the cladding.

公开(公告)号：US20240061192A1

公开(公告)日：2024-02-22

申请号：US17889233

申请日：2022-08-16

Applicant: Intel Corporation

Inventor： Chia-Pin CHIU ,  Finian ROGERS ,  Tim Tri HOANG ,  Kaveh HOSSEINI ,  Omkar KARHADE

IPC: G02B6/42

CPC classification number: G02B6/425 ,  G02B6/4243

Abstract: Embodiments disclosed herein include electronic packages and methods of forming electronic packages. In an embodiment, the electronic package comprises a package substrate, a die coupled to the package substrate, a photonics integrated circuit (PIC) coupled to the die, and a fiber array unit (FAU) optically coupled to the PIC. In an embodiment, the FAU has a base with a first width and a protrusion with a second width that is smaller than the first width.

公开(公告)号：US20230314849A1

公开(公告)日：2023-10-05

申请号：US17710703

申请日：2022-03-31

Applicant: Intel Corporation

Inventor： Chia-Pin CHIU ,  Kaveh HOSSEINI ,  Omkar KARHADE ,  Tim Tri HOANG

IPC: G02F1/01 ,  G02B6/293

CPC classification number: G02F1/0147 ,  G02B6/29395 ,  G02B6/2934 ,  G02F2203/15

Abstract: Embodiments disclosed herein include optoelectronic systems and methods of forming such systems. In an embodiment, an optoelectronic system comprises a first substrate, a second substrate over the first substrate, a micro-ring resonator (MRR) over the second substrate, a heater integrated into the MRR, a cladding over the MRR, an opening through the first substrate and the second substrate to expose a bottom surface of the MRR, and a base spanning across the opening.