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公开(公告)号：US20250004223A1
公开(公告)日：2025-01-02
申请号：US18346116
申请日：2023-06-30
Applicant: Intel Corporation
Inventor： Xiaoqian Li , Vidya Jayaram , Ravindranath V. Mahajan , Saikumar Jayaraman
IPC: G02B6/42
Abstract: An apparatus comprising an interposer to couple conductive contacts of a substrate to conductive contacts of an integrated circuit device, wherein the interposer comprises a cavity proximate conductive contacts of the interposer, the conductive contacts of the interposer to couple to conductive contacts of a photonics integrated circuit (PIC).
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