公开(公告)号：US20190006293A1

公开(公告)日：2019-01-03

申请号：US15638527

申请日：2017-06-30

Applicant: Intel Corporation

Inventor： John J Beatty ,  Suzana Prstic ,  Vipul V Mehta

IPC: H01L23/00 ,  H01L23/34

Abstract: A semiconductor package includes a semiconductor die arranged on a substrate. The semiconductor package includes a stiffener structure arranged on the substrate. The stiffener structure is spaced at a distance from the semiconductor die. The stiffener structure includes a molding compound material.

公开(公告)号：US10290592B2

公开(公告)日：2019-05-14

申请号：US15638527

申请日：2017-06-30

Applicant: Intel Corporation

Inventor： John J Beatty ,  Suzana Prstic ,  Vipul V Mehta

IPC: H01L23/00 ,  H01L23/34

Abstract: A semiconductor package includes a semiconductor die arranged on a substrate. The semiconductor package includes a stiffener structure arranged on the substrate. The stiffener structure is spaced at a distance from the semiconductor die. The stiffener structure includes a molding compound material.