公开(公告)号：US20200312803A1

公开(公告)日：2020-10-01

申请号：US16363996

申请日：2019-03-25

Applicant: Intel Corporation

Inventor： Jimin YAO ,  Shawna LIFF ,  Xin YAN ,  Numair AHMED

IPC: H01L23/00

Abstract: Embodiments herein relate to systems, apparatuses, or processes directed to an interconnect joint that includes multiple core balls within a solder compound where the multiple core balls are substantially linearly aligned. The multiple core balls, which may include copper or be a polymer, couple with each other within the solder and form a substantially linear alignment during reflow. In embodiments, four or more core balls may be used to achieve a high aspect ratio interconnect joint with a tight pitch.