公开(公告)号：US20240047341A1

公开(公告)日：2024-02-08

申请号：US17880359

申请日：2022-08-03

申请人： International Buisness Machines Corporation

发明人： Ruilong Xie ,  Nicholas Anthony Lanzillo ,  Brent A. Anderson ,  Reinaldo Vega ,  Albert M. Chu ,  Lawrence A. Clevenger

IPC分类号： H01L23/522 ,  H01L23/528 ,  H01L21/768

CPC分类号： H01L23/5226 ,  H01L23/5283 ,  H01L21/76877 ,  H01L21/76816

摘要： Interconnect designs with reduced via resistance are provided. In one aspect, an interconnect structure includes: at least a first metal line and a second metal line; and a conductive via in between the first metal line and the second metal line, wherein the conductive via has elongated dimensions along a major axis of the first metal line and along a major axis of the second metal line. Dielectric caps can be present on the first metal lines, and below and above the second metal lines. A method of forming the present interconnect structure is also provided.