公开(公告)号：US10387694B2

公开(公告)日：2019-08-20

申请号：US15487187

申请日：2017-04-13

申请人： International Business Machines Corporation

发明人： Ali Afzali-Ardakani ,  Homa Alemzadeh ,  Maryam Ashoori ,  Bahman Hekmatshoartabari ,  Elham Khabiri

IPC分类号： G06F11/30 ,  G06K7/10 ,  H01L23/29 ,  H01L21/56 ,  G01D18/00 ,  G06N20/00 ,  H01L23/31 ,  H01L21/683 ,  G01D21/00 ,  G06N3/04

摘要： Systems, methods, and electronic circuits facilitating embedded sensor chips in polymer-based coatings are provided. In one example, a method comprises fabricating an electronic circuit, the electronic circuit comprising one or more semiconductor devices, one or more sensors, and a communication element; encapsulating the electronic circuit within an insulator, resulting in an encapsulated circuit; and dispersing the encapsulated circuit into a lacquer solution comprising a polymer carrier and a solvent.

公开(公告)号：US20180300514A1

公开(公告)日：2018-10-18

申请号：US15842552

申请日：2017-12-14

申请人： International Business Machines Corporation

发明人： Ali Afzali-Ardakani ,  Homa Alemzadeh ,  Maryam Ashoori ,  Bahman Hekmatshoartabari ,  Elham Khabiri

IPC分类号： G06K7/10 ,  H01L23/29 ,  H01L21/56 ,  G01D18/00 ,  G06N99/00

摘要： Systems, methods, and electronic circuits facilitating embedded sensor chips in polymer-based coatings are provided. In one example, a method comprises fabricating an electronic circuit, the electronic circuit comprising one or more semiconductor devices, one or more sensors, and a communication element; encapsulating the electronic circuit within an insulator, resulting in an encapsulated circuit; and dispersing the encapsulated circuit into a lacquer solution comprising a polymer carrier and a solvent.

公开(公告)号：US11256883B2

公开(公告)日：2022-02-22

申请号：US16421018

申请日：2019-05-23

申请人： International Business Machines Corporation

发明人： Ali Afzali-Ardakani ,  Homa Alemzadeh ,  Maryam Ashoori ,  Bahman Hekmatshoartabari ,  Elham Khabiri

IPC分类号： G06F11/30 ,  G06K7/10 ,  H01L23/29 ,  H01L21/56 ,  G01D18/00 ,  G06N20/00 ,  G01D21/00 ,  H01L21/683 ,  H01L23/31 ,  G06N3/04

摘要： Systems, methods, and electronic circuits facilitating embedded sensor chips in polymer-based coatings are provided. In one example, a method comprises fabricating an electronic circuit, the electronic circuit comprising one or more semiconductor devices, one or more sensors, and a communication element; encapsulating the electronic circuit within an insulator, resulting in an encapsulated circuit; and dispersing the encapsulated circuit into a lacquer solution comprising a polymer carrier and a solvent.

公开(公告)号：US20190286859A1

公开(公告)日：2019-09-19

申请号：US16421018

申请日：2019-05-23

申请人： International Business Machines Corporation

发明人： Ali Afzali-Ardakani ,  Homa Alemzadeh ,  Maryam Ashoori ,  Bahman Hekmatshoartabari ,  Elham Khabiri

IPC分类号： G06K7/10 ,  G06N20/00 ,  G01D21/00 ,  H01L21/56 ,  H01L23/29 ,  G01D18/00 ,  H01L23/31 ,  H01L21/683

摘要： Systems, methods, and electronic circuits facilitating embedded sensor chips in polymer-based coatings are provided. In one example, a method comprises fabricating an electronic circuit, the electronic circuit comprising one or more semiconductor devices, one or more sensors, and a communication element; encapsulating the electronic circuit within an insulator, resulting in an encapsulated circuit; and dispersing the encapsulated circuit into a lacquer solution comprising a polymer carrier and a solvent.

公开(公告)号：US10783334B2

公开(公告)日：2020-09-22

申请号：US15842552

申请日：2017-12-14

申请人： International Business Machines Corporation

发明人： Ali Afzali-Ardakani ,  Homa Alemzadeh ,  Maryam Ashoori ,  Bahman Hekmatshoartabari ,  Elham Khabiri

IPC分类号： G06F11/30 ,  G06K7/10 ,  H01L23/29 ,  H01L21/56 ,  G01D18/00 ,  G06N20/00 ,  G01D21/00 ,  H01L21/683 ,  H01L23/31 ,  G06N3/04

摘要： Systems, methods, and electronic circuits facilitating embedded sensor chips in polymer-based coatings are provided. In one example, a method comprises fabricating an electronic circuit, the electronic circuit comprising one or more semiconductor devices, one or more sensors, and a communication element; encapsulating the electronic circuit within an insulator, resulting in an encapsulated circuit; and dispersing the encapsulated circuit into a lacquer solution comprising a polymer carrier and a solvent.

公开(公告)号：US20180300513A1

公开(公告)日：2018-10-18

申请号：US15487187

申请日：2017-04-13

申请人： International Business Machines Corporation

发明人： Ali Afzali-Ardakani ,  Homa Alemzadeh ,  Maryam Ashoori ,  Bahman Hekmatshoartabari ,  Elham Khabiri

IPC分类号： G06K7/10 ,  G01D18/00 ,  G06N99/00 ,  H01L21/56 ,  H01L23/29

CPC分类号： G06K7/10198 ,  G01D18/00 ,  G01D21/00 ,  G06K7/10316 ,  G06K7/10465 ,  G06N3/0445 ,  G06N3/0454 ,  G06N20/00 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/293 ,  H01L23/3135 ,  H01L2221/68354 ,  H01L2221/68368

摘要： Systems, methods, and electronic circuits facilitating embedded sensor chips in polymer-based coatings are provided. In one example, a method comprises fabricating an electronic circuit, the electronic circuit comprising one or more semiconductor devices, one or more sensors, and a communication element; encapsulating the electronic circuit within an insulator, resulting in an encapsulated circuit; and dispersing the encapsulated circuit into a lacquer solution comprising a polymer carrier and a solvent.