Circuit board fixing structure
    1.
    发明授权

    公开(公告)号:US11121490B1

    公开(公告)日:2021-09-14

    申请号:US16891090

    申请日:2020-06-03

    IPC分类号: H01R12/71

    摘要: A circuit board fixing structure comprising a first fixing element and a first circuit board is provided. The first fixing element includes a shaft, a first flange and a second flange. One end of the shaft is provided with a receiving portion. The first flange is connected with a side surface of the shaft. The second flange is connected with the side surface of the shaft and is spaced apart from the first flange. The first circuit board is fixed on a surface of the first flange away from the second flange.

    Structural element fixing structure and fixing element thereof

    公开(公告)号:US11439000B2

    公开(公告)日:2022-09-06

    申请号:US16891091

    申请日:2020-06-03

    发明人: Yung-Teng Fu

    IPC分类号: H05K1/02 F16M13/00

    摘要: A structural element fixing structure is provided. A flange of a first fixing element is connected with a side surface of a first shaft of the first fixing element. A first structure is fixed on the first fixing element. A second fixing element clamps the flange. An accommodating portion of the second fixing element is connected with a groove portion of the second fixing element. The accommodating portion has an accommodating space configured to accommodate the flange. A second shaft of the second fixing element is connected with the accommodating portion and is on a side of the accommodating portion facing away from the groove portion. A second structure is fixed on the second shaft of the second fixing element. The second fixing element separates the second structure and the first fixing element.

    Expansion card holding mechanism with a flow-guiding through hole aligned with a vent of a flow guiding structure in a device casing

    公开(公告)号:US10905024B1

    公开(公告)日:2021-01-26

    申请号:US16706848

    申请日:2019-12-09

    发明人: Yung-Teng Fu

    IPC分类号: H05K7/14 H05K5/02

    摘要: An expansion card holding mechanism is disposed on a flow guiding structure in a device casing. The expansion card holding mechanism includes a sliding slot structure and a sliding part. The sliding slot structure is disposed on the flow guiding structure and includes two opposite side walls. The sliding part includes a sliding body and a positioning portion. The sliding body is slidably disposed along a direction between the two side walls. The positioning portion protrudes from the sliding body and is slidably engaged with one of the two slide walls. The sliding body has a flow-guiding through hole and an expansion card holding slot. The flow-guiding through hole is aligned with a vent of the flow guiding structure in the direction, so that air flow can pass through the flow guiding structure and the sliding part for dissipating heat from an expansion card.

    CURVE FORMING AND RIVETING METHOD
    4.
    发明申请

    公开(公告)号:US20190151931A1

    公开(公告)日:2019-05-23

    申请号:US15863970

    申请日:2018-01-07

    IPC分类号: B21J15/02

    摘要: A curve forming and riveting method includes steps of providing a sheet metal member, a riveting member and a forming mold, wherein the forming mold has a curve forming portion; attaching the sheet metal member to the curve forming portion; assembling the riveting member to the sheet metal member; and riveting the riveting member and the sheet metal member together by the curve forming portion and forming a curve contour on the sheet metal member corresponding to the curve forming portion.