公开(公告)号：US20200214157A1

公开(公告)日：2020-07-02

申请号：US16708171

申请日：2019-12-09

Applicant: IonQ, Inc.

Inventor： Phillip SOLOMON ,  Kai HUDEK ,  Jason Madjdi AMINI

IPC: H05K5/06 ,  H05K5/00 ,  H05K1/18 ,  H01R25/00

Abstract: The disclosure describes various aspects of techniques that can be used for making hermetic feedthroughs for enclosures. For example, a panel that provides a hermetic seal to a system enclosure can include an enclosure board made of a printed circuit board (PCB) and configured to have a size and shape that precisely covers an access to the system enclosure, the enclosure board including multiple inner connectors on an inner side of the PCB facing the inside of the system enclosure and multiple outer connectors on an outer side of the PCB facing the outside the system enclosure for feeding one or more of signals or fluids (e.g., gases, liquids, vacuum) through the PCB by having inner and outer connectors connected through the PCB. The panel may further include a gasket fitting the size and shape of the enclosure board and used with the enclosure board to provide the hermetic seal.