公开(公告)号：US10529635B2

公开(公告)日：2020-01-07

申请号：US15493231

申请日：2017-04-21

Applicant: J-DEVICES CORPORATION

Inventor： Hisakazu Marutani ,  Minoru Kai ,  Kazuhiko Kitano

IPC: H01L23/31 ,  H01L21/56 ,  H01L21/82 ,  H01L23/544 ,  H01L23/00

Abstract: A manufacturing method of a semiconductor package includes locating a plurality of semiconductor packages on a substrate, forming a resin insulating layer covering the plurality of semiconductor devices, forming grooves, in the resin insulating layer, enclosing each of the plurality of semiconductor devices and reaching the substrate, and irradiating the substrate with laser light in positional correspondence with the grooves to separate the plurality of semiconductor devices from each other.