公开(公告)号：US09252390B2

公开(公告)日：2016-02-02

申请号：US14388876

申请日：2013-08-06

Applicant: JOLED INC.

Inventor： Hiroko Okumura ,  Hiroyuki Masuda

IPC: H01L21/30 ,  H01L27/32 ,  H01L51/52 ,  B32B7/12 ,  C09J5/00 ,  C09J7/00 ,  B32B38/00 ,  B32B38/10 ,  H01L51/56

CPC classification number: H01L51/5246 ,  B32B7/12 ,  B32B38/0008 ,  B32B38/10 ,  B32B38/105 ,  B32B2457/12 ,  C09J5/00 ,  C09J7/00 ,  H01L27/322 ,  H01L51/5253 ,  H01L51/56

Abstract: A method for manufacturing a joined body composed of a first substrate and a second substrate joined together by sealing resin material attached to a predetermined area of the first substrate includes: attaching a sheet material to the first substrate so as to cover the predetermined area, the sheet material including a sheet base material and the resin material provided on one main surface of the sheet base material; forming, after the attaching, in the sheet material, a slit by reducing a thickness of the resin material along an outline of the predetermined area; and separating, after the forming, part of the resin material inside the slit from the sheet base material to keep the part of the resin material inside the slit on the predetermined area of the first substrate and not to keep the rest of the resin material outside the slit on the first substrate.

Abstract translation: 一种用于制造由第一基板和第二基板组成的接合体的方法，该第一基板和第二基板通过密封附着在第一基板的预定区域上的树脂材料而连接在一起，包括：将片材附着到第一基板以覆盖预定区域， 片材，其包括片基材和设置在片基材的一个主表面上的树脂材料; 通过沿着预定区域的轮廓减小树脂材料的厚度，在片材中形成狭缝; 在片材基体材料的形成之后将树脂材料的一部分从片材基材分离出来，以将树脂材料的一部分保持在第一基板的预定区域上的狭缝内，而不将其余的树脂材料保持在外部 第一基板上的狭缝。

公开(公告)号：US09155135B2

公开(公告)日：2015-10-06

申请号：US14381037

申请日：2012-11-08

Applicant: JOLED INC.

Inventor： Hiroko Okumura

IPC: H01J1/62 ,  H05B33/04 ,  H01L51/52 ,  H05B33/10

CPC classification number: H05B33/04 ,  H01L51/5246 ,  H01L51/5253 ,  H05B33/10

Abstract: A display device includes: an element substrate on which light-emitting elements are arranged, the light-emitting elements being arranged in a display region of the element substrate; a sealing resin layer located over the light-emitting elements arranged on the element substrate; and an opposite substrate located opposite the element substrate with the sealing resin layer therebetween. The sealing resin layer includes: a first sealing portion formed along an outer periphery of the display region so as to have a frame-like shape; a second sealing portion formed so as to cover the display region within the first sealing portion; and a dendritic portion being a branched extension of the second sealing portion that extends into the first sealing portion. A tip of the dendritic portion is located within an outer periphery of the first sealing portion.

Abstract translation: 显示装置包括：发光元件布置在其上的元件基板，发光元件布置在元件基板的显示区域中; 设置在所述元件基板上的发光元件上方的密封树脂层; 以及与元件基板相对的相对的基板，其间具有密封树脂层。 密封树脂层包括：沿着显示区域的外周形成具有框状形状的第一密封部; 第二密封部分，形成为覆盖第一密封部分内的显示区域; 以及树突部分，其是延伸到第一密封部分中的第二密封部分的分支延伸部分​​。 树枝状部分的尖端位于第一密封部分的外周边内。

公开(公告)号：US10062741B2

公开(公告)日：2018-08-28

申请号：US14388874

申请日：2013-08-02

Applicant: JOLED INC.

Inventor： Hiroko Okumura ,  Takuya Satoh

IPC: H01L27/32 ,  H01L51/00 ,  H01L51/56 ,  B32B38/00 ,  B32B38/10 ,  H01L51/52 ,  B32B37/18

CPC classification number: H01L27/3251 ,  B32B37/18 ,  B32B38/0008 ,  B32B38/10 ,  B32B2038/0076 ,  H01L27/322 ,  H01L51/0013 ,  H01L51/0024 ,  H01L51/003 ,  H01L51/5246 ,  H01L51/56 ,  H01L2227/323

Abstract: A method of manufacturing joined body including: firstly, putting sheet material in intimate contact with first substrate to cover, with resin layer of sheet material, areas of first substrate including first area, boundary area surrounding first area, and second area located across from first area with respect to boundary area, sheet material being laminate including resin layer and separable layer, resin layer containing uncured sealing resin; secondly, curing sealing resin in part of resin layer covering boundary area; thirdly, removing, along with separable layer, part of resin layer covering second area in one direction from one end towards the other of two ends of second area; and fourthly, joining first substrate and second substrate together by arranging second substrate to face first substrate and curing sealing resin with parts of resin layer covering boundary area and first area located between second substrate and first substrate.

公开(公告)号：US09905811B2

公开(公告)日：2018-02-27

申请号：US14411686

申请日：2013-08-06

Applicant: JOLED INC.

Inventor： Hiroko Okumura

IPC: H01L51/56 ,  H01L51/00 ,  C09J5/00 ,  H01L51/52 ,  H01L27/32

CPC classification number: H01L51/56 ,  C09J5/00 ,  C09J2203/318 ,  H01L27/322 ,  H01L51/0024 ,  H01L51/5253 ,  H01L2251/556

Abstract: A method of manufacturing a joined body, including: covering a first area and a second area of a first substrate with a sheet of resin in uncured state; separating a part of the sheet covering the second area from the first substrate, the separating performed after the covering; and joining the first substrate with a second substrate by arranging the second substrate to face the first substrate with a part of the sheet covering the first area between the first substrate and the second substrate, and curing the resin in the part of the sheet covering the first area, the joining performed after the separating. In the method, during the separating, a phase difference δ between stress and strain in the part of the sheet covering the second area is no greater than 48 degrees.