公开(公告)号：US20150158990A1

公开(公告)日：2015-06-11

申请号：US14555967

申请日：2014-11-28

Applicant: JSP CORPORATION

Inventor： Shota TAKAGI ,  Akinobu HIRA ,  Kazutoshi SASAKI

IPC: C08J9/228

CPC classification number: C08J9/228 ,  B29C44/04 ,  B29C44/3461 ,  B29C44/445 ,  C08J9/0061 ,  C08J9/0066 ,  C08J9/16 ,  C08J9/224 ,  C08J9/232 ,  C08J2323/02 ,  C08J2323/06 ,  C08J2323/14 ,  C08J2323/20 ,  C08J2423/02 ,  C08J2423/26 ,  Y10T428/2998

Abstract: An inorganic filler-containing, polyolefin-based resin expanded bead having an expanded core layer of a first polyolefin-based resin, and a cover layer of a second polyolefin-based resin that covers the expanded core layer, wherein a weight ratio of the cover layer to the expanded core layer is 1:99 to 20:80, the expanded core layer contains an inorganic filler in a weight percentage amount of 5 to 90%, and the cover layer contains no inorganic filler or contains an inorganic filler in a weight percentage amount lower than that in the expanded core layer.

Abstract translation: 1.一种无机填料的聚烯烃类树脂发泡珠，其具有第一聚烯烃系树脂的发泡芯层和覆盖所述发泡芯层的第二聚烯烃系树脂的覆盖层，所述覆盖层的重量比 发泡芯层为1:99〜20:80，发泡芯层含有重量百分比为5〜90％的无机填料，覆盖层不含无机填料或含有重量以下的无机填料 百分比低于膨胀核心层的百分比。