公开(公告)号：US11904579B2

公开(公告)日：2024-02-20

申请号：US17905890

申请日：2021-02-12

Applicant: JSP CORPORATION

Inventor： Takashi Oi ,  Hajime Ohta

IPC: B32B27/08 ,  B32B27/32

CPC classification number: B32B27/08 ,  B32B27/32 ,  B32B2250/02 ,  B32B2266/025 ,  B32B2553/00

Abstract: A molded article of polypropylene-based resin expanded beads, obtained by in-mold molding of the polypropylene-based resin expanded beads, each bead including: a core layer, in a foamed state, having a polypropylene-based resin; and a covering layer, which covers the core layer, having a polyethylene-based resin. A molded article magnification X [times] of the molded article is 55 times to 90 times, a value of a product X·σ50 of a 50% compressive stress σ50 [kPa] and the molded article magnification X is 6500 or more, and a 5% compressive stress σ5 of the expanded beads molded article is 5 kPa to 25 kPa.