公开(公告)号：US20230041656A1

公开(公告)日：2023-02-09

申请号：US17942332

申请日：2022-09-12

Applicant: JSR CORPORATION

Inventor： Yugaku TAKAGI ,  Tsubasa Abe ,  Takashi Katagiri ,  Satoshi Dei ,  Kazunori Takanashi ,  Yuya Hayashi

IPC: C08G8/12 ,  C08F220/22 ,  C08F216/02 ,  C08G8/24 ,  G03F7/11 ,  H01L21/027

Abstract: A composition includes: a compound including an aromatic ring; and a first polymer including a first structural unit represented by formula (1) and a second structural unit represented by formula (2). A content of the first polymer with respect to 100 parts by mass of the compound is no less than 0.1 parts by mass and no greater than 200 parts by mass. R1 represents a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group; and R2 represents a substituted or unsubstituted monovalent hydrocarbon group. R3 represents a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group; L represents a single bond or a divalent linking group; Ar represents a group obtained by removing (n+1) hydrogen atoms from a substituted or unsubstituted aromatic ring; R4 represents a hydroxy group or a monovalent hydroxyalkyl group; and n is an integer of 1 to 8.

公开(公告)号：US20210115221A1

公开(公告)日：2021-04-22

申请号：US17134593

申请日：2020-12-28

Applicant: JSR CORPORATION

Inventor： Shun Aoki ,  Takashi Katagiri ,  Kazunori Takanashi ,  Motoyuki Shima

IPC: C08K5/092 ,  C08G61/10 ,  C08G61/04 ,  H01L21/02 ,  B08B7/00

Abstract: A composition enables particles to be removed from a surface of a substrate by: applying the composition on the surface of the substrate to form a substrate treatment film on the surface; and bringing a liquid into contact with the substrate treatment film to remove the substrate treatment film from the surface. The composition includes a resin; and a solvent. The solvent includes a first solvent component having a normal boiling point of no less than 175° C. A content of the first solvent component with respect to 100 parts by mass of the resin is no less than 1 part by mass.