BONDING STRUCTURE AND ELECTRONIC DEVICE USING THE SAME
    1.
    发明申请
    BONDING STRUCTURE AND ELECTRONIC DEVICE USING THE SAME 有权
    使用相同的结合结构和电子设备

    公开(公告)号:US20130107432A1

    公开(公告)日:2013-05-02

    申请号:US13632275

    申请日:2012-10-01

    IPC分类号: H05K7/00 B32B1/04

    CPC分类号: G06F1/1626 Y10T428/13

    摘要: A bonding structure includes a first connecting part, a second connecting part and an adhesive. The first connecting part includes a top surface and a first joining surface opposite to the top surface. The second connecting part includes a mounting surface and defines a bonding groove on the mounting surface, the second connecting part further includes positioning members in the bonding groove. The adhesive is received in the bonding groove of the second connecting part, then the first connecting part is received in the bonding groove. The first joining surface is supported by the positioning members to position the first connecting part, the adhesive is located between the first joining surface and a bottom of the bonding groove to join the first and the second connecting part together. The present disclosure further discloses an electronic device using the bonding structure.

    摘要翻译: 接合结构包括第一连接部分,第二连接部分和粘合剂。 第一连接部分包括顶表面和与顶表面相对的第一接合表面。 第二连接部分包括安装表面并且在安装表面上限定了接合槽,第二连接部分还包括接合槽中的定位构件。 粘合剂被接收在第二连接部的接合槽中,然后第一连接部被容纳在接合槽中。 第一接合面被定位构件支撑以定位第一连接部分,粘合剂位于接合槽的第一接合表面和底部之间,以将第一和第二连接部分接合在一起。 本公开进一步公开了一种使用该接合结构的电子设备。

    CHIP CARD HOLDING MECHANISM AND PORTABLE ELECTRONIC DEVICE
    2.
    发明申请
    CHIP CARD HOLDING MECHANISM AND PORTABLE ELECTRONIC DEVICE 失效
    CHIP卡保持机制和便携式电子设备

    公开(公告)号:US20130033845A1

    公开(公告)日:2013-02-07

    申请号:US13303377

    申请日:2011-11-23

    IPC分类号: H05K5/00

    CPC分类号: G06K13/085

    摘要: A portable electronic device includes a housing and a chip card holding mechanism assembled within the housing. The housing defines a mounting slot and an unlocking hole adjacent to the mounting slot. The chip card holding mechanism includes a support base assembled adjacent to the mounting slot, a receiving tray and an unlocking assembly. The receiving tray is slidably mounted on the support base and includes a tray body and an operating portion formed at one end of the tray body. The operating portion has a resisting surface. The unlocking assembly includes a cam body rotatably assembled to the housing and a driving member. The cam body forms a cam resisting portion resisting against the resisting surface of the receiving tray. The driving portion is inserted into the unlocking hole for driving the cam body to rotate thereby ejecting the receiving tray.

    摘要翻译: 便携式电子设备包括壳体和组装在壳体内的芯片卡保持机构。 壳体限定安装槽和与安装槽相邻的解锁孔。 芯片卡保持机构包括与安装槽相邻组装的支撑基座,接收托盘和解锁组件。 接收托盘可滑动地安装在支撑基座上,并且包括托盘主体和形成在托盘主体一端的操作部分。 操作部分具有阻力表面。 解锁组件包括可旋转地组装到壳体的凸轮体和驱动构件。 凸轮体形成抵抗接收托盘的阻力表面的凸轮抵抗部分。 驱动部分插入到解锁孔中,用于驱动凸轮体旋转,从而弹出接收盘。

    LENS MODULE AND ELECTRONIC DEVICE USING THE SAME
    3.
    发明申请
    LENS MODULE AND ELECTRONIC DEVICE USING THE SAME 失效
    使用相同的镜头模块和电子设备

    公开(公告)号:US20130033769A1

    公开(公告)日:2013-02-07

    申请号:US13301874

    申请日:2011-11-22

    IPC分类号: G02B7/02

    CPC分类号: G02B7/02 G03B17/12

    摘要: An electronic device using a lens module is disclosed. The lens module for a housing, comprises a barrel comprising a containing portion; and at least one lens insert molded mounted in the containing portion; wherein the containing portion comprises an inner sidewall, and a first latching portion in the inner sidewall; the at least one lens comprises a main body, and a second latching portion extends outward from a side surface of the main body; the second latching portion is received in the first latching portion.

    摘要翻译: 公开了一种使用透镜模块的电子设备。 一种用于壳体的透镜模块,包括一个包含容纳部分的筒体; 以及安装在所述容纳部中的至少一个透镜嵌入件; 其中所述容纳部分包括内侧壁,以及在所述内侧壁中的第一闭锁部分; 所述至少一个透镜包括主体,并且第二闩锁部分从主体的侧表面向外延伸; 第二闩锁部分被容纳在第一闩锁部分中。

    FIXING DEVICE
    4.
    发明申请
    FIXING DEVICE 有权
    固定装置

    公开(公告)号:US20120299234A1

    公开(公告)日:2012-11-29

    申请号:US13246976

    申请日:2011-09-28

    IPC分类号: B23Q3/06

    CPC分类号: B23Q3/06

    摘要: A fixing device for fixing a workpiece includes a base, a first pressing block pressing the workpiece to the base, a second pressing block, a first support member, a second support member, and a side pressing block. The workpiece includes a preprocessing portion to be machined, which has an inner surface and an outer surface, the inner and outer surfaces of the preprocessing portion are sandwiched between non-rigid materials during a machining process to avoid the generating of swarfs.

    摘要翻译: 用于固定工件的固定装置包括基座,将工件压向基座的第一按压块,第二按压块,第一支撑构件,第二支撑构件和侧按压块。 工件包括具有内表面和外表面的待加工的预处理部分,在加工过程中预处理部分的内表面和外表面被夹在非刚性材料之间,以避免产生切屑。

    PROTECTIVE HOUSING FOR ELECTRONIC DEVICE
    5.
    发明申请
    PROTECTIVE HOUSING FOR ELECTRONIC DEVICE 有权
    电子设备保护壳

    公开(公告)号:US20130048333A1

    公开(公告)日:2013-02-28

    申请号:US13447426

    申请日:2012-04-16

    IPC分类号: B65D85/00 H05K5/00

    摘要: A protective housing for an electronic device includes a main body, a protective cover, and a connecting mechanism. The protective cover is rotatably and detachably mounted to the main body by the connecting mechanism. The connecting mechanism includes a first magnetic assembly, a second magnetic assembly, and a mounting base. The first magnetic assembly is assembled within the main body, the second magnetic assembly is assembled within the mounting base. The mounting base is pivotally hinged to the protective cover, and the first magnetic assembly and the second magnetic assembly attract each other, thereby connecting the main body and the protective cover together.

    摘要翻译: 一种用于电子设备的保护壳体包括主体,保护盖和连接机构。 保护盖通过连接机构可旋转地可拆卸地安装到主体。 连接机构包括第一磁性组件,第二磁性组件和安装基座。 第一磁性组件组装在主体内,第二磁性组件组装在安装基座内。 安装基座枢转地铰接到保护盖,并且第一磁性组件和第二磁性组件彼此吸引,从而将主体和保护盖连接在一起。

    MILLING CUTTER
    6.
    发明申请
    MILLING CUTTER 审中-公开
    铣刀

    公开(公告)号:US20120282043A1

    公开(公告)日:2012-11-08

    申请号:US13283318

    申请日:2011-10-27

    IPC分类号: B23C5/14

    摘要: A cutter comprises a cutter handle, a cutter neck and a cutter head. The cutter neck interconnects the cutter handle and the cutter head. The cutter head comprises a connecting side surface adjoining the cutter neck, an outer annular surface, a distal end surface opposite to the connecting side surface and away from the cutter neck, and at least one cutting edge formed on the outer annular surface extending from the junction of the connecting side surface and the cutter neck toward the distal end surface, and at least one cutting trough formed on the cutter head adjacent to the at least one cutting edge extending from the junction of the connecting side surface and the cutter neck toward the distal end surface.

    摘要翻译: 刀具包括刀柄,刀颈和刀头。 刀柄与刀柄和刀头相互连接。 切割头包括与切割器颈部相邻的连接侧表面,外部环形表面,与连接侧表面相对并远离切割器颈部的远端表面,以及形成在外部环形表面上的至少一个切割刃 连接侧表面和切割器颈部朝向远端表面的接合处;以及至少一个切割槽,该切割槽形成在切割头上,邻近于从连接侧表面和切割器颈部的接合部延伸的至少一个切割边缘 远端表面。

    BONDING STRUCTURE
    7.
    发明申请
    BONDING STRUCTURE 审中-公开
    结合结构

    公开(公告)号:US20130084431A1

    公开(公告)日:2013-04-04

    申请号:US13534213

    申请日:2012-06-27

    IPC分类号: B32B3/10 B32B37/00 B32B38/10

    摘要: A bonding structure includes a first connecting body, an adhesive, and a second connecting body. The first connecting body has a bonding surface subject to one or more recessed grooves. The second connecting body is bonded to the bonding surface of the first connecting body by the adhesive. The bonding surface of the first connecting body defines an adhesive receiving groove, the adhesive is received in the adhesive receiving groove and bonds with the second connecting body; the adhesive receiving groove defines an initial adhesive receiving portion recessed from a bottom surface of a portion of the adhesive receiving groove; the initial adhesive receiving portion is for receiving injected adhesive, a depth of the initial adhesive receiving portion is slightly greater than that of the adhesive receiving groove to allow flow and expansion of the glue into the adhesive receiving groove when external force to bond is applied.

    摘要翻译: 接合结构包括第一连接体,粘合剂和第二连接体。 第一连接体具有经受一个或多个凹槽的接合表面。 第二连接体通过粘合剂结合到第一连接体的接合表面。 第一连接体的接合表面限定粘合剂接收槽,粘合剂容纳在粘合剂接收槽中并与第二连接体结合; 粘合剂容纳槽限定从粘合剂容纳槽的一部分的底表面凹陷的初始粘合剂接收部分; 初始粘合剂接收部分用于接收注入的粘合剂,初始粘合剂接收部分的深度稍微大于粘合剂接收槽的深度,以允许当施加外力作用时胶水流入和膨胀到粘合剂接收槽中。

    ELECTRONIC DEVICE HOUSING ASSEMBLY AND MANUFACTURING METHOD THEREOF
    8.
    发明申请
    ELECTRONIC DEVICE HOUSING ASSEMBLY AND MANUFACTURING METHOD THEREOF 失效
    电子设备外壳组件及其制造方法

    公开(公告)号:US20120127040A1

    公开(公告)日:2012-05-24

    申请号:US13163871

    申请日:2011-06-20

    IPC分类号: H01Q1/24 H01P11/00

    摘要: A housing assembly includes an outer housing, a support member, an antenna cover, a foam member, and an adhesive member. The outer housing defines an antenna opening. The support member is positioned in the outer housing, and encloses the antenna opening. The support member defines a receiving portion for receiving an antenna module, and the receiving portion is aligned with the antenna opening. The antenna cover is positioned in the antenna opening. Both of the foam member and the adhesive member are positioned between the support member and the antenna cover, and the foam member surrounds the adhesive member. The adhesive member connects or fixes the antenna cover to the support member. A method of manufacturing the housing assembly is also provided.

    摘要翻译: 壳体组件包括外壳,支撑构件,天线罩,泡沫构件和粘合构件。 外壳限定天线开口。 支撑构件定位在外壳中,并且包围天线开口。 支撑构件限定用于接收天线模块的接收部分,并且接收部分与天线开口对准。 天线盖位于天线开口中。 泡沫构件和粘合构件都位于支撑构件和天线盖之间,并且泡沫构件围绕着粘合构件。 粘合构件将天线盖连接或固定到支撑构件。 还提供了制造壳体组件的方法。

    INTERNAL STRUCTURE FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE USING THE SAME
    9.
    发明申请
    INTERNAL STRUCTURE FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE USING THE SAME 审中-公开
    用于电子设备的内部结构和使用该电子设备的电子设备

    公开(公告)号:US20130050915A1

    公开(公告)日:2013-02-28

    申请号:US13303141

    申请日:2011-11-23

    IPC分类号: H05K5/00 H05K7/18

    CPC分类号: G06F1/1658

    摘要: An internal structure for an electronic device includes a fixed frame, and a plurality of magnetic assemblies. A plurality of mounting portions are defined in the inner wall of the fixed frame. Each magnetic assembly includes a magnetic member and an elastic element. Both the magnetic member and the elastic element are assembled in the mounting portion. The magnetic member is sandwiched between the inner wall of the fixed frame and the elastic element.

    摘要翻译: 电子设备的内部结构包括固定框架和多个磁性组件。 多个安装部分限定在固定框架的内壁中。 每个磁性组件包括磁性构件和弹性元件。 磁性构件和弹性元件都组装在安装部分中。 磁性构件被夹在固定框架的内壁和弹性元件之间。

    ELECTRONIC DEVICE
    10.
    发明申请
    ELECTRONIC DEVICE 失效
    电子设备

    公开(公告)号:US20110291955A1

    公开(公告)日:2011-12-01

    申请号:US12848345

    申请日:2010-08-02

    IPC分类号: G06F3/041 H05K7/00

    CPC分类号: G06F1/1626

    摘要: An electronic device includes a housing, at least two elastic latching members, an inner frame received in the housing, and at least two fixing members. The housing defines at least two locking portions, the inner frame defines at least two fixing portions, the at least two elastic latching members are fixed to the corresponding fixing portions by the fixing members, and each of the elastic latching members protrudes from the corresponding fixing portion and is latched with the corresponding locking portions.

    摘要翻译: 电子设备包括壳体,至少两个弹性闭锁构件,容纳在壳体中的内框架和至少两个固定构件。 壳体限定至少两个锁定部分,内框架限定至少两个固定部分,所述至少两个弹性闩锁部件通过固定部件固定到相应的固定部分,并且每个弹性闩锁部件从相应的固定件 并且与相应的锁定部分锁定。