Method of fabricating liquid crystal display device having sealant patterns, dummy patterns, and substrate protective patterns
    1.
    发明授权
    Method of fabricating liquid crystal display device having sealant patterns, dummy patterns, and substrate protective patterns 失效
    制造具有密封剂图案,虚拟图案和基板保护图案的液晶显示装置的方法

    公开(公告)号:US07016008B2

    公开(公告)日:2006-03-21

    申请号:US10310847

    申请日:2002-12-06

    IPC分类号: G02F1/1339

    CPC分类号: G02F1/133351 G02F1/1339

    摘要: A method of fabricating a liquid crystal display which prevents breakage of a substrate in a thin liquid crystal display panel. The method includes forming a plurality of sealant patterns defining a liquid layer on a first substrate, a plurality of dummy patterns between the sealant patterns, and a plurality of protective patterns on crossings between the dummy patterns; bonding a second substrate to the first substrate, forming a plurality of scribing lines on a surface of either the first or second substrate; and cutting the first and second substrates along the scribing lines.

    摘要翻译: 一种液晶显示器的制造方法,其防止薄型液晶显示面板中的基板断裂。 该方法包括在第一基板上形成限定液体层的多个密封剂图案,密封剂图案之间的多个虚设图案和虚设图案之间的交叉处的多个保护图案; 将第二基板接合到第一基板,在第一或第二基板的表面上形成多个划线; 以及沿着划线切割第一和第二基板。

    Liquid crystal display device
    2.
    发明授权

    公开(公告)号:US07110057B2

    公开(公告)日:2006-09-19

    申请号:US10328396

    申请日:2002-12-23

    申请人: Jae Young Jeon

    发明人: Jae Young Jeon

    IPC分类号: G02F1/1333 G02F1/1343

    摘要: In a liquid crystal display device that prevents corrosion of a signal line in the device, a plurality of signal lines are provided at the inner side of a cutting line on a substrate. A shorting bar is provided at the outer side of the cutting line. A connection line connects the signal lines to the shorting bar in such a manner to cross the cutting line. Thus, the signal line is connected to the shorting bar with the aid of the connection line formed from a transparent conductive material at an area corresponding to the cutting line of a lower substrate. The connection line is exposed when the lower substrate is cut along the cutting line, so that corrosion of the signal line can be prevented.