公开(公告)号：US06841425B2

公开(公告)日：2005-01-11

申请号：US10282741

申请日：2002-10-28

申请人： Jae-Il Lee ,  Jeong-Ho Bang ,  Young-Moon Lee ,  Hyo-Geun Chae

发明人： Jae-Il Lee ,  Jeong-Ho Bang ,  Young-Moon Lee ,  Hyo-Geun Chae

IPC分类号： H01L21/82 ,  H01L23/31 ,  H01L23/525

CPC分类号： H01L23/3171 ,  H01L23/5258 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods for treating a wafer to protect a fuse box of a semiconductor chip are provided. These methods include applying an insulating coating solution onto the surface of at least one of a plurality of fuse boxes in a semiconductor chip so as to prevent moisture or impurities from seeping into the fuse box. With these methods, the degradation of the semiconductor chip can be substantially reduced by protecting the fuse box from a high-temperature and very humid atmosphere, and impurities such as particles. Thus, characteristics and reliability of the semiconductor chip can be also improved.

摘要翻译： 提供了用于处理晶片以保护半导体芯片的保险丝盒的方法。 这些方法包括在半导体芯片中的多个保险丝盒中的至少一个的表面上施加绝缘涂层溶液，以防止水分或杂质渗入保险丝盒中。 利用这些方法，通过保护熔丝盒免受高温和非常潮湿的气氛以及诸如颗粒的杂质，可以显着降低半导体芯片的劣化。 因此，也可以提高半导体芯片的特性和可靠性。