公开(公告)号：US08360828B2

公开(公告)日：2013-01-29

申请号：US12875764

申请日：2010-09-03

申请人： Jan-Chen Huang ,  Chu-Ching Sung ,  Ming-Yu Huang

发明人： Jan-Chen Huang ,  Chu-Ching Sung ,  Ming-Yu Huang

IPC分类号： B24B7/00

CPC分类号： H01L21/67092 ,  B24D3/346 ,  B24D5/12 ,  B26D7/27 ,  Y10T83/828

摘要： A cutting tool suitable for cutting a workpiece placed on a photocurable adhesive layer is provided. The cutting tool includes a main body, a cutting layer and a light emitting material. The cutting layer is disposed on a surface of the main body and is applicable in cutting the workpiece. The light emitting material is disposed inside the cutting layer or between the main body and the cutting layer. The light emitting material is suitable for emitting a light capable of curing the photocurable adhesive layer adjacent to a cutting path as the workpiece is cut by the cutting layer.

摘要翻译： 提供了适用于切割放置在光固化粘合剂层上的工件的切削工具。 切割工具包括主体，切割层和发光材料。 切割层设置在主体的表面上，可应用于切割工件。 发光材料设置在切割层内部或主体与切割层之间。 发光材料适于在切割层切割工件时发射能够固化与切割路径相邻的光固化粘合剂层的光。

公开(公告)号：US20110259166A1

公开(公告)日：2011-10-27

申请号：US12875764

申请日：2010-09-03

申请人： Jan-Chen Huang ,  Chu-Ching Sung ,  Ming-Yu Huang

发明人： Jan-Chen Huang ,  Chu-Ching Sung ,  Ming-Yu Huang

IPC分类号： B26D7/27

CPC分类号： H01L21/67092 ,  B24D3/346 ,  B24D5/12 ,  B26D7/27 ,  Y10T83/828

摘要： A cutting tool suitable for cutting a workpiece placed on a photocurable adhesive layer is provided. The cutting tool includes a main body, a cutting layer and a light emitting material. The cutting layer is disposed on a surface of the main body and is applicable in cutting the workpiece. The light emitting material is disposed inside the cutting layer or between the main body and the cutting layer. The light emitting material is suitable for emitting a light capable of curing the photocurable adhesive layer adjacent to a cutting path as the workpiece is cut by the cutting layer.

摘要翻译： 提供了适用于切割放置在光固化粘合剂层上的工件的切削工具。 切割工具包括主体，切割层和发光材料。 切割层设置在主体的表面上，可应用于切割工件。 发光材料设置在切割层内部或主体与切割层之间。 发光材料适于在切割层切割工件时发射能够固化与切割路径相邻的光固化粘合剂层的光。