公开(公告)号：US20210280610A1

公开(公告)日：2021-09-09

申请号：US17189404

申请日：2021-03-02

Applicant: Japan Display Inc.

Inventor： Manabu YAMASHITA

IPC: H01L27/12

Abstract: Disclosed is a semiconductor device including a gate wiring, an active layer, a gate insulating film, a first wiring, a second wring, and a first semiconductor film. The gate wiring includes a gate electrode. The active layer overlaps with the gate electrode and contains an oxide semiconductor. The gate insulating film is sandwiched by the gate electrode and the active layer. The first wiring and the second wiring are each located over the active layer and respectively include a first terminal and a second terminal which are electrically connected to the active layer. The first semiconductor film is located under and in contact with the first wiring and contains the oxide semiconductor.

公开(公告)号：US20170040569A1

公开(公告)日：2017-02-09

申请号：US15229629

申请日：2016-08-05

Applicant: Japan Display Inc.

Inventor： Kazufumi WATABE ,  Hiroshi KAWANAGO ,  Manabu YAMASHITA ,  Hideaki ISHIGE

IPC: H01L51/52 ,  H01L51/00 ,  H01L27/32 ,  H01L51/56

CPC classification number: H01L51/5253 ,  H01L27/3244 ,  H01L51/003 ,  H01L51/5203 ,  H01L51/56 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/566

Abstract: First rib layers made of an inorganic material are formed in first frame regions of a first glass substrate. First resin layers are formed in first product regions after the first rib layers are formed. First functional layers which include light emitting element layers as a result of luminance of each of unit pixels forming an image being controlled and sealing layers covering the light emitting element layers are formed on the first rib layers and the first resin layers. The first rib layers and the first functional layers are cut along lines passing through the first frame regions while avoiding the first product regions in order to separate the first product regions from each other. In the step of cutting the first rib layers and the first functional layers, the first rib layers and the sealing layers are cut.

Abstract translation: 在第一玻璃基板的第一框架区域中形成由无机材料制成的第一肋层。 在形成第一肋层之后，在第一产品区域中形成第一树脂层。 作为形成被控制的图像的单位像素的亮度和覆盖发光元件层的密封层的发光元件层的第一功能层形成在第一肋层和第一树脂层上。 沿着穿过第一框架区域的线切割第一肋层和第一功能层，同时避免第一产品区域以将第一产品区域彼此分离。 在切割第一肋层和第一功能层的步骤中，切割第一肋层和密封层。