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公开(公告)号:USD614699S1
公开(公告)日:2010-04-27
申请号:US29343987
申请日:2009-09-22
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公开(公告)号:USD614698S1
公开(公告)日:2010-04-27
申请号:US29343980
申请日:2009-09-22
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公开(公告)号:USD614701S1
公开(公告)日:2010-04-27
申请号:US29343995
申请日:2009-09-22
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公开(公告)号:USD614700S1
公开(公告)日:2010-04-27
申请号:US29343992
申请日:2009-09-22
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公开(公告)号:US08651004B2
公开(公告)日:2014-02-18
申请号:US11962628
申请日:2007-12-21
IPC分类号: B26F1/14
CPC分类号: B26D7/18 , B26D2007/0018 , B26D2007/0087 , B26F1/36 , Y10T83/222 , Y10T83/9423 , Y10T83/9428 , Y10T83/943 , Y10T83/9476
摘要: A punch includes a base and a chip cartridge that is movably coupled to the base. The chip cartridge is movable between a first position and a second position relative to the base and defines a chamber that is configured to receive and hold chips produced during a punching operation. The chip cartridge includes a chip receiving portion that is configured to receive chips created during the punching operation and to permit entry of the chips into the chamber while the chip cartridge is in the first position. When the chip cartridge is in the second position, the chip receiving portion provides communication between the chamber and outside the chamber via an area less than or equal to about 200 percent of a surface area of the chip produced by the punch.
摘要翻译: 冲头包括可移动地联接到基座的基座和芯片卡盘。 芯片卡盘可相对于基座在第一位置和第二位置之间移动,并且限定了一个被配置为接收和保持在冲压操作期间产生的切屑的腔室。 芯片盒包括芯片接收部分,其被配置为接收在冲压操作期间产生的芯片并且允许芯片进入腔室,同时芯片盒处于第一位置。 当芯片卡盘处于第二位置时,芯片接收部分经由小于或等于由冲头产生的芯片的表面积的约百分之二的面积在室之间提供腔室之间的连通。
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公开(公告)号:US20090158908A1
公开(公告)日:2009-06-25
申请号:US11962628
申请日:2007-12-21
IPC分类号: B26F1/14
CPC分类号: B26D7/18 , B26D2007/0018 , B26D2007/0087 , B26F1/36 , Y10T83/222 , Y10T83/9423 , Y10T83/9428 , Y10T83/943 , Y10T83/9476
摘要: A punch includes a base and a chip cartridge that is movably coupled to the base. The chip cartridge is movable between a first position and a second position relative to the base and defines a chamber that is configured to receive and hold chips produced during a punching operation. The chip cartridge includes a chip receiving portion that is configured to receive chips created during the punching operation and to permit entry of the chips into the chamber while the chip cartridge is in the first position. When the chip cartridge is in the second position, the chip receiving portion provides communication between the chamber and outside the chamber via an area less than or equal to about 200 percent of a surface area of the chip produced by the punch.
摘要翻译: 冲头包括可移动地联接到基座的基座和芯片卡盘。 芯片卡盘可相对于基座在第一位置和第二位置之间移动,并且限定了一个被配置为接收和保持在冲压操作期间产生的切屑的腔室。 芯片盒包括芯片接收部分,其被配置为接收在冲压操作期间产生的芯片并且允许芯片进入腔室,同时芯片盒处于第一位置。 当芯片卡盘处于第二位置时,芯片接收部分经由小于或等于由冲头产生的芯片的表面积的约百分之二的面积在室之间提供腔室之间的连通。
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公开(公告)号:USD686655S1
公开(公告)日:2013-07-23
申请号:US29389548
申请日:2011-04-13
申请人: Paul A. Aries , Kaushik Patel , Jason B. Magid
设计人: Paul A. Aries , Kaushik Patel , Jason B. Magid
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公开(公告)号:USD686656S1
公开(公告)日:2013-07-23
申请号:US29389551
申请日:2011-04-13
申请人: Paul A. Aries , Kaushik Patel , Jason B. Magid
设计人: Paul A. Aries , Kaushik Patel , Jason B. Magid
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