Apparatus and Methods for Vacuum-Compatible Substrate Thermal Management
    1.
    发明申请
    Apparatus and Methods for Vacuum-Compatible Substrate Thermal Management 有权
    真空兼容基板热管理的设备和方法

    公开(公告)号:US20120057856A1

    公开(公告)日:2012-03-08

    申请号:US12875720

    申请日:2010-09-03

    IPC分类号: F27D11/12 H05B1/02

    摘要: One embodiment relates to an apparatus for vacuum-compatible substrate thermal management. The apparatus includes a load-lock chamber coupled to a vacuum chamber, a light-emitting diode array, and a substrate stage. The load-lock chamber is configured to hold a substrate prior to the substrate being transferred into the vacuum chamber, and a substrate stage is configured to hold the substrate in the vacuum chamber. The light-emitting diode array is configured to warm the substrate while the substrate is in the load-lock chamber. Other features, aspects and embodiments are also disclosed.

    摘要翻译: 一个实施例涉及用于真空兼容的基板热管理的装置。 该装置包括耦合到真空室的负载锁定室,发光二极管阵列和衬底台。 负载锁定室被配置为在将衬底转移到真空室之前保持衬底,并且衬底台被配置为将衬底保持在真空室中。 发光二极管阵列被配置为在衬底处于装载锁定室的同时加热衬底。 还公开了其它特征,方面和实施例。