METHOD OF FABRICATING SEMICONDUCTOR DEVICE
    1.
    发明申请
    METHOD OF FABRICATING SEMICONDUCTOR DEVICE 有权
    制造半导体器件的方法

    公开(公告)号:US20120220058A1

    公开(公告)日:2012-08-30

    申请号:US13406655

    申请日:2012-02-28

    IPC分类号: H01L21/66

    CPC分类号: G03F7/70125 G03F1/70

    摘要: A method of fabricating a semiconductor device includes preparing a layout of the semiconductor device, obtaining contrast of an exposure image of the layout through a simulation under a condition of using a crosspole illumination system, separating the layout into a plurality of sub-layouts based on the contrast of the exposure image, forming a photomask having a mask pattern corresponding to the plurality of sub-layouts, and performing an exposure process using the photomask under an exposure condition of using a dipole illumination system.

    摘要翻译: 一种制造半导体器件的方法包括:准备半导体器件的布局,在使用交叉极照明系统的条件下通过仿真获得布局的曝光图像的对比度,将布局分为多个子布局 曝光图像的对比度,形成具有对应于多个子布局的掩模图案的光掩模,以及在使用偶极照明系统的曝光条件下使用光掩模进行曝光处理。