公开(公告)号：US06859056B2

公开(公告)日：2005-02-22

申请号：US10176147

申请日：2002-06-20

申请人： Jin-Chuan Bai ,  Huan-Ping Su ,  Soon-Aik Lu

发明人： Jin-Chuan Bai ,  Huan-Ping Su ,  Soon-Aik Lu

IPC分类号： G01R1/04 ,  G01R31/02

CPC分类号： G01R1/0408

摘要： A test fixture for semiconductor packages and a test method of using the test fixture are proposed. The test fixture is composed of a circuit board, an interposer and a covering member. The circuit board is used to accommodate semiconductor packages and electrically connect the semiconductor packages to a test device. The interposer is mounted on the circuit board, and formed with through holes for receiving the semiconductor packages therein. The covering member is attached onto the interposer, and provided with elastic mechanisms for holding the semiconductor packages in position. By using the test fixture, semiconductor packages can be firmly coupled to the test device where functional tests are performed.

摘要翻译： 提出了半导体封装的测试夹具和使用测试夹具的测试方法。 测试夹具由电路板，插入件和覆盖件构成。 电路板用于容纳半导体封装并将半导体封装电连接到测试装置。 插入器安装在电路板上，并形成有用于在其中接收半导体封装的通孔。 覆盖构件附接到插入件上，并且设置有用于将半导体封装保持在适当位置的弹性机构。 通过使用测试夹具，半导体封装可以牢固地耦合到执行功能测试的测试设备。