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公开(公告)号：US07774725B1
公开(公告)日：2010-08-10
申请号：US11593465
申请日：2006-11-06
IPC分类号： G06F17/50
CPC分类号： G06F17/5036
摘要： A method of simulating operation of a VLSI interconnect structure having capacitive and inductive coupling between nodes thereof. A matrix X and a matrix Y containing different combinations of passive circuit element values for the interconnect structure are obtained where the element values for each matrix include inductance L and inverse capacitance P. An adjacency matrix A associated with the interconnect structure is obtained. Numerical integration is used to solve first and second equations, each including as a factor the product of the inverse matrix X1 and at least one other matrix, with first equation including X1Y, X1A, and X1P, and the second equation including X1A and X1P.
摘要翻译： 一种模拟在其节点之间具有电容和电感耦合的VLSI互连结构的操作的方法。 获得包含互连结构的无源电路元件值的不同组合的矩阵X和矩阵Y，其中每个矩阵的元素值包括电感L和反相电容P.获得与互连结构相关联的邻接矩阵A. 数值积分用于求解第一和第二方程，每一方程式包括作为因子的逆矩阵X1和至少一个其他矩阵的乘积，其中第一方程包括X1Y，X1A和X1P，第二方程包括X1A和X1P。
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公开(公告)号：US08336014B1
公开(公告)日：2012-12-18
申请号：US12852942
申请日：2010-08-09
IPC分类号： G06F17/50
CPC分类号： G06F17/5036
摘要： A method of simulating operation of a VLSI interconnect structure having capacitive and inductive coupling between nodes thereof. A matrix X and a matrix Y containing different combinations of passive circuit element values for the interconnect structure are obtained where the element values for each matrix include inductance L and inverse capacitance P. An adjacency matrix A associated with the interconnect structure is obtained. Numerical integration is used to solve first and second equations, each including as a factor the product of the inverse matrix X−1 and at least one other matrix, with first equation including X−1Y, X−1A, and X−1P, and the second equation including X−1A and X−1P.
摘要翻译： 一种模拟在其节点之间具有电容和电感耦合的VLSI互连结构的操作的方法。 获得包含互连结构的无源电路元件值的不同组合的矩阵X和矩阵Y，其中每个矩阵的元素值包括电感L和反相电容P.获得与互连结构相关联的邻接矩阵A. 数值积分用于求解第一和第二方程，每一方程式包括作为逆矩阵X-1和至少一个其他矩阵的乘积的因子，第一方程包括X-1Y，X-1A和X-1P，以及 第二方程包括X-1A和X-1P。
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