公开(公告)号：US06918877B2

公开(公告)日：2005-07-19

申请号：US10635687

申请日：2003-08-05

申请人： John A. Hossack ,  Gregory L. Woicik

发明人： John A. Hossack ,  Gregory L. Woicik

IPC分类号： A61B8/00 ,  A61B8/06 ,  B06B1/02 ,  B06B1/06 ,  G01H11/06 ,  G10K11/34

CPC分类号： G10K11/346 ,  B06B1/0292 ,  B06B1/0622 ,  G01H11/06

摘要： Practical diagnostic ultrasound arrays invariably exhibit a degree of unwanted inter-element cross coupling or cross talk. This results in degraded beam performance that in turn results in degraded image resolution (spatial resolution and contrast performance). Current approaches to reducing inter element coupling may be costly and may make the transducer array fragile. There is a need to overcome the cross talk problem with minimal expense and impact on reliability. The approach taken here overcomes a substantial component of the cross talk with minimal expense. The approach is versatile and has applicability in both transmit and receive. The approach improves image resolution. This technique has particular applicability in the field of silicon substrate based MEMS transducers in which the continuous, low loss, silicon wafer substrate gives rise to significant unwanted cross talk.

摘要翻译： 实际的诊断超声阵列总是表现出一定程度的不必要的元件间交叉耦合或串扰。 这导致光束性能下降，从而导致图像分辨率降低（空间分辨率和对比度性能）。 减少元件间耦合的当前方法可能是昂贵的，并且可能使得换能器阵列易碎。 需要以最小的成本和对可靠性的影响来克服串扰问题。 这里采取的方法克服了交叉话题的重要组成部分，并以最低的费用。 该方法是多功能的，并且在发送和接收两者中都具有适用性。 该方法提高了图像分辨率。 该技术在基于硅衬底的MEMS传感器领域中具有特别的适用性，其中连续的低损耗硅晶片衬底产生显着的不希望的串扰。