公开(公告)号：US5874026A

公开(公告)日：1999-02-23

申请号：US982049

申请日：1997-12-01

申请人： John P. Pilsits, Jr. ,  Ann M. Cognetti ,  Jasbir S. Gill

发明人： John P. Pilsits, Jr. ,  Ann M. Cognetti ,  Jasbir S. Gill

IPC分类号： C02F5/12 ,  C09D1/00 ,  C09D5/16 ,  C09D7/12 ,  C10M173/02 ,  C23F11/14 ,  C23F11/10

CPC分类号： C23F11/149

摘要： A method of use of a composition including either or both isomers of hydrogenated methylbenzotriazole, namely, 5-Methyl-1H-Benzotriazole or 4-Methyl-1H-Benzotriazole which have been at least about 50% hydrogenated, to form corrosion inhibiting films on metal surfaces in an aqueous environment. The hydrogenated methylbenzotriazole compositions provide both improved passivation and improved film persistence when charged to aqueous industrial systems either on a continuous or on an intermittent basis. Continuous dosing is generally kept at a constant >0.5, typically 1-2 ppm in the aqueous system to be treated; intermittent doses are generally 10-20 ppm once every week or two or more. Beyond the improved characteristics described above, films formed from the inventive composition also reduce spiking in corrosion rates immediately following halogen addition; foster faster return to pre-halogenation corrosion rates post-halogenation; and reduce the rate of conversion of phosphonate to orthophosphate, which reduces scale potential. For these reasons, the present compositions are either continuously or intermittently fed and effective to inhibit corrosion of copper and copper alloy surfaces subjected to alkaline, neutral or slightly acidic aqueous systems.

摘要翻译： 使用包含氢化甲基苯并三唑的任一种或两种异构体的方法，即至少约50％氢化的5-甲基-1H-苯并三唑或4-甲基-1H-苯并三唑，以在金属上形成腐蚀抑制膜 在水性环境中的表面。 氢化的甲基苯并三唑组合物在连续或间歇地加入含水工业系统时提供改进的钝化和改善的膜持久性。 连续给料通常在待处理的水系统中保持在常数> 0.5，通常为1-2ppm; 间歇剂量通常为每周一次或二次或更多次为10-20ppm。 除了上述改进的特征之外，由本发明组合物形成的薄膜还可以在卤素添加后立即减少腐蚀速率的尖峰; 促进更快地回到卤化后的预卤化腐蚀速率; 并降低膦酸酯转化为正磷酸盐的速度，从而降低了电位。 由于这些原因，本发明的组合物是连续地或间歇地进料并且有效地抑制经受碱性，中性或微酸性水性体系的铜和铜合金表面的腐蚀。