公开(公告)号：US20050018376A1

公开(公告)日：2005-01-27

申请号：US10820863

申请日：2004-04-09

申请人： Jong-rok Park ,  Jae-yong Cho ,  Byeong-sun An

发明人： Jong-rok Park ,  Jae-yong Cho ,  Byeong-sun An

IPC分类号： H01L21/68 ,  H01L21/683 ,  H02N13/00 ,  H01H1/00

CPC分类号： H01L21/6831

摘要： An electrostatic chuck (ESC) for a wafer which directs a cooling gas to predetermined cooling areas of the wafer mounted on the chuck. Ring type sealing members divide the mounted wafer into the predetermined cooling areas and the predetermined cooling areas are independently supplied with a helium cooling gas. Each of the predetermined cooling areas is supplied through a separate conduit system wherein each conduit system has a single inlet into the chuck and a plurality of outlets which emit the helium gas into a respective one of the predetermined cooling areas. The plurality of outlets for each predetermined cooling area may communicate with the inlet via a respective plurality of branch conduits or via one or more branch conduits and a peripheral conduit which connects the plurality of outlets. By independently controlling the predetermined cooling areas, temperature variations on the wafer are effectively controlled.

摘要翻译： 一种用于晶片的静电卡盘（ESC），其将冷却气体引导到安装在卡盘上的晶片的预定冷却区域。 环形密封构件将安装的晶片分成预定的冷却区域，并且预定的冷却区域被独立地供给氦冷却气体。 每个预定的冷却区域通过单独的管道系统供应，其中每个管道系统具有进入卡盘的单个入口以及将氦气排放到相应的一个预定冷却区域中的多个出口。 用于每个预定冷却区域的多个出口可以经由相应的多个分支管道或经由一个或多个分支导管和连接多个出口的周边导管与入口连通。 通过独立地控制预定的冷却区域，有效地控制晶片上的温度变化。

公开(公告)号：US20050018377A1

公开(公告)日：2005-01-27

申请号：US10823550

申请日：2004-04-14

申请人： Jae-yong Cho ,  Byeong-sun An ,  Jin-man Kim ,  Kyung-sun Kim

发明人： Jae-yong Cho ,  Byeong-sun An ,  Jin-man Kim ,  Kyung-sun Kim

IPC分类号： H01L21/68 ,  H01L21/683 ,  H02N13/00 ,  H01H1/00

CPC分类号： H01L21/6833 ,  Y10S156/915

摘要： An ESC (Electrostatic Chuck) to chuck an object by electrostatic force, having an ESC main body supporting the object; a guide ring supported by the ESC main body and encircling the object; a dielectric material layer interposed between the guide ring and the ESC main body; a media gas supplier to supply a media gas to the guide ring; and a power supplier to supply power to the ESC main body. With this configuration, the ESC provides an apparatus to chuck a guide ring to an ESC main body, while maintaining the guide ring and an object, such as a wafer, at the same or similar temperature, thereby enhancing uniformity of the object during a semiconductor manufacturing process such as etching, deposition, or the like.

摘要翻译： 通过静电力夹住物体的ESC（静电卡盘），具有支撑物体的ESC主体; 由ESC主体支撑并环绕物体的导向环; 介于导向环和ESC主体之间的电介质材料层; 介质气体供应器，用于向引导环供应介质气体; 以及向ESC主体供电的电源。 利用这种结构，ESC提供了一种将ESC导向环夹持到ESC主体的装置，同时保持引导环和诸如晶片的物体处于相同或相似的温度，从而在半导体中提高物体的均匀性 制造工艺如蚀刻，沉积等。

公开(公告)号：US07102872B2

公开(公告)日：2006-09-05

申请号：US10823550

申请日：2004-04-14

申请人： Jae-yong Cho ,  Byeong-sun An ,  Jin-man Kim ,  Kyung-sun Kim

发明人： Jae-yong Cho ,  Byeong-sun An ,  Jin-man Kim ,  Kyung-sun Kim

IPC分类号： H01H1/00

CPC分类号： H01L21/6833 ,  Y10S156/915

摘要： An ESC (Electrostatic Chuck) to chuck an object by electrostatic force, having an ESC main body supporting the object; a guide ring supported by the ESC main body and encircling the object; a dielectric material layer interposed between the guide ring and the ESC main body; a media gas supplier to supply a media gas to the guide ring; and a power supplier to supply power to the ESC main body. With this configuration, the ESC provides an apparatus to chuck a guide ring to an ESC main body, while maintaining the guide ring and an object, such as a wafer, at the same or similar temperature, thereby enhancing uniformity of the object during a semiconductor manufacturing process such as etching, deposition, or the like.

摘要翻译： 通过静电力夹住物体的ESC（静电卡盘），具有支撑物体的ESC主体; 由ESC主体支撑并环绕物体的导向环; 介于导向环和ESC主体之间的电介质材料层; 介质气体供应器，用于向引导环供应介质气体; 以及向ESC主体供电的电源。 利用这种结构，ESC提供了一种将ESC导向环夹持到ESC主体的装置，同时保持引导环和诸如晶片的物体处于相同或相似的温度，从而在半导体中提高物体的均匀性 制造工艺如蚀刻，沉积等。