专利检索 ap:("Joong-ho Yoon" OR "Tackyung Kim" OR "Kang-Sup Roh" OR "Jun-Seok Kim" OR "Eun-Jung Lee") AND inv:"Kang-Sup Roh" 第 1 页

1.

发明授权
Semiconductor devices having lower and upper interconnection structures that exhibit reduced coupling 有权
标题翻译：具有降低的耦合的具有较低和较高互连结构的半导体器件

公开(公告)号：US08614507B2

公开(公告)日：2013-12-24

申请号：US12889499

申请日：2010-09-24

申请人： Joong-ho Yoon , Tackyung Kim , Kang-Sup Roh , Jun-Seok Kim , Eun-Jung Lee

发明人： Joong-ho Yoon , Tackyung Kim , Kang-Sup Roh , Jun-Seok Kim , Eun-Jung Lee

IPC分类号： H01L23/48

CPC分类号： H01L23/522 , H01L27/11521 , H01L27/11524 , H01L2924/0002 , H01L2924/00

摘要： An interconnection structure for a semiconductor device may include lower interconnection patterns disposed in a checker board shape and upper interconnection patterns disposed in a checker board shape and connecting two adjacent lower interconnection patterns to each other.

摘要翻译： 用于半导体器件的互连结构可以包括以棋盘形状布置的较低互连图案和以棋盘形状布置并且将两个相邻的下部互连图案彼此连接的上部互连图案。

2.

发明申请
Semiconductor Devices Having Interconnection Structures 有权
标题翻译：具有互连结构的半导体器件

公开(公告)号：US20110121455A1

公开(公告)日：2011-05-26

申请号：US12889499

申请日：2010-09-24

申请人： Joong-ho Yoon , Taekyung Kim , Kang-Sup Roh , Jun-Seok Kim , Eun-Jung Lee

发明人： Joong-ho Yoon , Taekyung Kim , Kang-Sup Roh , Jun-Seok Kim , Eun-Jung Lee

IPC分类号： H01L23/532 , H01L23/52

CPC分类号： H01L23/522 , H01L27/11521 , H01L27/11524 , H01L2924/0002 , H01L2924/00

摘要： An interconnection structure for a semiconductor device may include lower interconnection patterns disposed in a checker board shape and upper interconnection patterns disposed in a checker board shape and connecting two adjacent lower interconnection patterns to each other.

摘要翻译： 用于半导体器件的互连结构可以包括以棋盘形状布置的较低互连图案和以棋盘形状布置并且将两个相邻的下部互连图案彼此连接的上部互连图案。