保存成功
保存失败
公开(公告)号:US20090122494A1
公开(公告)日:2009-05-14
申请号:US11918075
申请日:2006-02-18
申请人: Josef Schmidt , Peter Weichselbaumer , Dirk Riese
发明人: Josef Schmidt , Peter Weichselbaumer , Dirk Riese
IPC分类号: H05K7/20 , H05K3/00
CPC分类号: H05K7/142 , H05K7/1417 , H05K7/20436 , H05K7/20854 , Y10T29/49124
摘要: Disclosed is a cooling device (1) for a printed circuit board (2) which is disposed in a housing (3) and can be connected in a locking manner to a metal cooling element (4) that is formed as a cover of said housing (3).
摘要翻译: 公开了一种用于印刷电路板(2)的冷却装置(1),该冷却装置(1)设置在壳体(3)中并且可以以锁定方式连接到金属冷却元件(4),所述金属冷却元件(4)形成为所述壳体 (3)。