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公开(公告)号：US5159265A
公开(公告)日：1992-10-27
申请号：US762185
申请日：1991-09-19
IPC分类号： G01R1/067
CPC分类号： G01R1/06722
摘要： A pivotable spring probe (30) includes a housing (36) having an opening, a plunger (34) within and guided by the housing, the plunger being slidingly movable between an extended position and a retracted position, a pivotable contact head (32) mounted on the plunger for making electrical contact with a conductive surface external to the housing, and a spring (42) mounted on the bottom of the plunger for biasing the plunger towards the housing opening.
摘要翻译： 可枢转的弹簧探针（30）包括具有开口的壳体（36），位于壳体内并由壳体引导的柱塞（34），柱塞可在延伸位置和缩回位置之间滑动移动，可枢转的接触头（32） 安装在所述柱塞上用于与所述壳体外部的导电表面电接触;以及弹簧（42），其安装在所述柱塞的底部上，用于将所述柱塞朝向所述壳体开口偏压。
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公开(公告)号：US06373139B1
公开(公告)日：2002-04-16
申请号：US09413705
申请日：1999-10-06
申请人： Peggy L. Clark
发明人： Peggy L. Clark
IPC分类号： H01L2352
CPC分类号： H01L23/49838 , H01L2924/0002 , H01L2924/00
摘要： A layout for a ball grid array (BGA) device (500) includes a set of solder ball pads (512) and a set of interconnection vias (510). Each one of said the set of interconnection vias (510) is coupled to a corresponding one of the solder ball pads (512). The interconnection vias (510) are laid out such that they provide for increased room for both vertical and horizontal traces (602, 702 and 802). With the BGA device (500) divided by an X-axis and a Y-axis to form four quadrants, two other axes V and W, are established rotated 45 degrees from the X and Y axes respectively. The solder pads (512) and interconnection vias (510) are on laid out on lines along or parallel to the V and W axes. The interconnection vias (510) in the four quadrants are located closer to the edge margins of the BGA device (500) than their corresponding solder ball pads (512).
摘要翻译： 用于球栅阵列（BGA）装置（500）的布局包括一组焊球（512）和一组互连通孔（510）。 所述一组互连通孔（510）中的每一个耦合到相应的一个焊球焊盘（512）。 互连通孔（510）布置成使得它们为垂直和水平迹线（602,702和802）提供增加的空间。 使用BGA器件（500）除以X轴和Y轴以形成四个象限，另外两个轴V和W分别与X轴和Y轴旋转45度。 焊盘（512）和互连通孔（510）沿着或平行于V轴和W轴线上布置。 四个象限中的互连通孔（510）比其对应的焊球垫（512）更靠近BGA器件（500）的边缘。
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