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公开(公告)号:US07849727B2
公开(公告)日:2010-12-14
申请号:US12065296
申请日:2006-07-12
IPC分类号: G01N7/00
CPC分类号: G01N33/0047 , G01N27/14 , G01N33/0031
摘要: A gas-sensing semiconductor device 1′ is fabricated on a silicon substrate 2′ having a thin silicon dioxide insulating layer 3′ in which a resistive heater 6 made of doped single crystal silicon formed simultaneously with source and drain regions of CMOS circuitry is embedded. The device 1′ includes a sensing area provided with a gas-sensitive layer 9′ separated from the heater 6′ by an insulating layer 4′. As one of the final fabrication steps, the substrate 2′ is back-etched so as to form a thin membrane in the sensing area. The heater 6′ has a generally circular-shaped structure surrounding a heat spreading plate 16′, and consists of two sets 20′, 21′ of meandering resistors having arcuate portions nested within one another and interconnected in labyrinthine form. The fabrication of the heater at the same time as the source and drain regions of CMOS circuitry is particularly advantageous in that the gas-sensing semiconductor device is produced without requiring any fabrication steps in addition to those already employed in the IC processing apart from a post-CMOS back etch and deposition of the gas-sensitive layer. The circular design is advantageous in that it is the best solution to minimise the size of the membrane at fixed power loss and heated area.
摘要翻译: 在具有薄的二氧化硅绝缘层3'的硅衬底2'上制造气体感测半导体器件1',其中嵌入与CMOS电路的源极和漏极区域同时形成的由掺杂单晶硅制成的电阻加热器6。 装置1'包括具有通过绝缘层4'与加热器6'分离的气敏层9'的感测区域。 作为最终制造步骤之一,衬底2'被反蚀刻以在感测区域中形成薄膜。 加热器6'具有围绕散热板16'的大致圆形结构,并且由具有彼此嵌套并且以迷宫形式互连的弓形部分的曲折电阻器的两组20',21'组成。 与CMOS电路的源极和漏极区域同时地制造加热器是特别有利的,因为除了在后处理中已经用于IC处理中的那些之外,制造气体感测半导体器件不需要任何制造步骤 -CMOS背蚀刻和气敏层的沉积。 圆形设计是有利的,因为它是在固定功率损耗和加热面积下最小化膜尺寸的最佳解决方案。
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公开(公告)号:US20090126460A1
公开(公告)日:2009-05-21
申请号:US12065296
申请日:2006-07-12
CPC分类号: G01N33/0047 , G01N27/14 , G01N33/0031
摘要: A gas-sensing semiconductor device 1′ is fabricated on a silicon substrate 2′ having a thin silicon dioxide insulating layer 3′ in which a resistive heater 6 made of doped single crystal silicon formed simultaneously with source and drain regions of CMOS circuitry is embedded. The device 1′ includes a sensing area provided with a gas-sensitive layer 9′ separated from the heater 6′ by an insulating layer 4′. As one of the final fabrication steps, the substrate 2′ is back-etched so as to form a thin membrane in the sensing area. The heater 6′ has a generally circular-shaped structure surrounding a heat spreading plate 16′, and consists of two sets 20′, 21′ of meandering resistors having arcuate portions nested within one another and interconnected in labyrinthine form. The fabrication of the heater at the same time as the source and drain regions of CMOS circuitry is particularly advantageous in that the gas-sensing semiconductor device is produced without requiring any fabrication steps in addition to those already employed in the IC processing apart from a post-CMOS back etch and deposition of the gas-sensitive layer. The circular design is advantageous in that it is the best solution to minimise the size of the membrane at fixed power loss and heated area.
摘要翻译: 在具有薄的二氧化硅绝缘层3'的硅衬底2'上制造气体感测半导体器件1',其中嵌入与CMOS电路的源极和漏极区域同时形成的由掺杂单晶硅制成的电阻加热器6。 装置1'包括具有通过绝缘层4'与加热器6'分离的气敏层9'的感测区域。 作为最终制造步骤之一,衬底2'被反蚀刻以在感测区域中形成薄膜。 加热器6'具有围绕散热板16'的大致圆形结构,并且由具有彼此嵌套并且以迷宫形式互连的弓形部分的曲折电阻器的两组20',21'组成。 与CMOS电路的源极和漏极区域同时地制造加热器是特别有利的,因为除了在后处理中已经用于IC处理中的那些之外,制造气体感测半导体器件不需要任何制造步骤 -CMOS背蚀刻和气敏层的沉积。 圆形设计是有利的,因为它是在固定功率损耗和加热面积下最小化膜尺寸的最佳解决方案。
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公开(公告)号:US07495300B2
公开(公告)日:2009-02-24
申请号:US11092654
申请日:2005-03-30
IPC分类号: H01L29/78
CPC分类号: G01N27/128
摘要: A gas-sensing semiconductor device is fabricated on a silicon substrate having a thin silicon oxide insulating layer in which a resistive heater made of a CMOS compatible high temperature metal is embedded. The high temperature metal is tungsten. The device includes at least one sensing area provided with a gas-sensitive layer separated from the heater by an insulating layer. As one of the final fabrication steps, the substrate is back-etched so as to form a thin membrane in the sensing area. Except for the back-etch and the gas-sensitive layer formation, that are carried out post-CMOS, all other layers, including the tungsten resistive heater, are made using a CMOS process employing tungsten metallisation. The device can be monolithically integrated with the drive, control and transducing circuitry using low cost CMOS processing. The heater, the insulating layer and other layers are made within the CMOS sequence and they do not require extra masks or processing.
摘要翻译: 气体感测半导体器件制造在具有薄的氧化硅绝缘层的硅衬底上,其中嵌入由CMOS兼容的高温金属制成的电阻加热器。 高温金属是钨。 该装置包括设置有通过绝缘层与加热器分离的气敏层的至少一个感测区域。 作为最终制造步骤之一,衬底被反蚀刻以在感测区域中形成薄膜。 除了在CMOS之后执行的背蚀刻和气敏层形成之外,包括钨电阻加热器在内的所有其它层均采用采用钨金属化的CMOS工艺制成。 该器件可以使用低成本CMOS处理与驱动器,控制和转换电路单片集成。 加热器,绝缘层和其他层是在CMOS序列内制成的,它们不需要额外的掩模或处理。
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