Bump forming apparatus
    1.
    发明授权
    Bump forming apparatus 失效
    凹凸成型装置

    公开(公告)号:US5573170A

    公开(公告)日:1996-11-12

    申请号:US353134

    申请日:1994-12-09

    摘要: In an apparatus for punching a metallic sheet to stamp out a bump and bonding it to a substrate, an AuSn sheet is heated to above a softening point thereof by a heater. A solenoid is energized to cause a punch and a die to stamp out a bump from the AuSn sheet. The bump is directly bonded to a substrate. The punch is made up of a shank portion and a punch portion. A punch holder for guiding the shank portion and punch portion with high accuracy molded integrally with the die. The punch is connected to the solenoid with the intermediary of a damper spring. When the bump hits against the substrate, the damper spring prevents it from chipping off or cracking due to an impact. Subsequently, another solenoid is energized to move the punch further downward, thereby pressing the bump against the substrate for a sufficient period of time.

    摘要翻译: 在金属片冲压装置中冲压凸块并将其粘合到基板上时,通过加热器将AuSn片材加热到其软化点以上。 螺线管通电,使冲头和模具从AuSn板上冲出凸块。 凸块直接结合到基板上。 冲头由柄部和冲头部组成。 用于以与模具一体成型的高精度引导柄部和冲头部的冲头保持架。 冲头与阻尼弹簧中间的螺线管连接。 当凸块撞击基板时,阻尼弹簧防止其由于冲击而破裂或开裂。 随后,另一个螺线管被通电以使冲头进一步向下移动,从而将凸块压靠在基板上足够长的时间。