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公开(公告)号：USD662622S1
公开(公告)日：2012-06-26
申请号：US29398771
申请日：2011-08-04
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公开(公告)号：USD662624S1
公开(公告)日：2012-06-26
申请号：US29398777
申请日：2011-08-04
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公开(公告)号：USD662621S1
公开(公告)日：2012-06-26
申请号：US29398712
申请日：2011-08-03
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公开(公告)号：USD685505S1
公开(公告)日：2013-07-02
申请号：US29397934
申请日：2011-07-22
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公开(公告)号：USD662623S1
公开(公告)日：2012-06-26
申请号：US29398773
申请日：2011-08-04
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公开(公告)号：US20130083549A1
公开(公告)日：2013-04-04
申请号：US13598150
申请日：2012-08-29
申请人： Yuichiro Takahara , Masahiko Kamata , Hiroshi Matsushita , Hiromichi Nakajima , Shigeru Osawa , Shinichiro Matsumoto
发明人： Yuichiro Takahara , Masahiko Kamata , Hiroshi Matsushita , Hiromichi Nakajima , Shigeru Osawa , Shinichiro Matsumoto
IPC分类号： F21V29/00
CPC分类号： F21S8/026 , F21V15/01 , F21V23/005 , F21V29/70 , F21V29/713 , F21V29/89 , F21Y2115/10
摘要： According to one embodiment, the device main body includes a main body portion, a protruding portion, and a heat conducting portion. The main body portion has an opening on one end side and has a wall portion on the other end side that is opposite to the opening side. The protruding portion protrudes from the wall portion and an inside thereof continues into the main body portion. The heat conducting portion has one end side thereof protruding from the wall portion toward the opening and has the other end side thereof connected to the protruding portion in a way that enables heat conduction. The light emitting unit is connected to the one end side of the heat conducting portion in a way that enables heat conduction. The lighting unit is housed inside the device main body and a portion of the lighting circuit component is arranged inside the protruding portion.
摘要翻译： 根据一个实施例，装置主体包括主体部分，突出部分和导热部分。 主体部在一端侧具有开口部，在与开口侧相反的另一端侧具有壁部。 突出部从壁部突出，其内部延伸到主体部。 导热部的一端侧从壁部向开口突出，另一端侧以突出部与导热部连接。 发光单元以能够进行热传导的方式连接到导热部分的一端侧。 照明单元容纳在设备主体内部，并且照明电路部件的一部分布置在突出部分的内部。
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公开(公告)号：US20140169004A1
公开(公告)日：2014-06-19
申请号：US14239451
申请日：2011-09-27
申请人： Hiromichi Nakajima , Shinichiro Matsumoto , Masahiko Kamata , Yuichiro Takahara , Hiroshi Matsushita , Shinichi Kumashiro , Shigeru Osawa
发明人： Hiromichi Nakajima , Shinichiro Matsumoto , Masahiko Kamata , Yuichiro Takahara , Hiroshi Matsushita , Shinichi Kumashiro , Shigeru Osawa
IPC分类号： F21V29/00
CPC分类号： F21V29/507 , F21K9/20 , F21K9/68 , F21S8/026 , F21V23/0442 , F21V29/70 , F21Y2115/10
摘要： A lamp device includes a semiconductor light-emitting element. The lamp device includes a housing including a heat conductive part, and the heat conductive part is thermally connected to an external thermal radiator. Heat generated by the semiconductor light-emitting element is conducted to the thermal radiator through the heat conductive part. A thermosensor is thermally connected to the heat conductive part. The lamp device includes a lighting circuit to light the semiconductor light-emitting element, and the lighting circuit controls an output of the semiconductor light-emitting element according to detection of the thermosensor.
摘要翻译： 灯装置包括半导体发光元件。 灯装置包括：壳体，包括导热部分，并且热传导部分热连接到外部散热器。 由半导体发光元件产生的热量通过导热部件传导到散热器。 热传感器热连接到导热部分。 灯装置包括点亮电路以点亮半导体发光元件，并且点亮电路根据热敏传感器的检测来控制半导体发光元件的输出。
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公开(公告)号：US08641246B2
公开(公告)日：2014-02-04
申请号：US13298490
申请日：2011-11-17
CPC分类号： F21V29/20 , F21K9/20 , F21S8/02 , F21V3/02 , F21V19/0005 , F21V23/006 , F21V29/713 , F21V29/773 , F21V29/89 , F21Y2105/10 , F21Y2115/10 , F21Y2115/20
摘要： According to one embodiment, a lamp unit includes a light-emitting module, a lighting circuit, and a housing. The light-emitting module includes a light emitting portion having a semiconductor light-emitting element. The lighting circuit lights the semiconductor light-emitting element. The housing includes a case opening in the direction of irradiation of light, and a base on a side of the case opposite from the direction of radiation of the light. The lighting circuit is accommodated in the case, and the light-emitting module is mounted on the base at a position closer to the base with respect to the position of the lighting circuit.
摘要翻译： 根据一个实施例，灯单元包括发光模块，照明电路和壳体。 发光模块包括具有半导体发光元件的发光部分。 照明电路点亮半导体发光元件。 壳体包括在照射光的方向上的壳体开口，以及位于壳体的与光的辐射方向相反的一侧的基部。 照明电路容纳在壳体中，并且发光模块相对于照明电路的位置在靠近基座的位置安装在基座上。
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公开(公告)号：US20130170233A1
公开(公告)日：2013-07-04
申请号：US13496869
申请日：2011-07-15
申请人： Kenji Nezu , Shigeru Osawa , Yuichiro Takahara , Takeshi Osada , Toshifumi Masuda , Hiromichi Nakajima
发明人： Kenji Nezu , Shigeru Osawa , Yuichiro Takahara , Takeshi Osada , Toshifumi Masuda , Hiromichi Nakajima
IPC分类号： F21V15/01
CPC分类号： F21V15/01 , F21K9/20 , F21S8/02 , F21V23/004 , F21V23/006 , F21V29/74 , F21Y2115/10 , H01R33/465
摘要： A lamp device 14 includes a light-emitting portion 34 in which a semiconductor light-emitting element is used. The light-emitting portion 34 is arranged on the side of one of surfaces of the housing 16. Provided on the side of the other surface of the housing 16 is a metallic cap portion 44 and a lamp pin 46 projecting from the other surface side of the housing 16. The lighting circuit 21 is stored in the housing 16. Then, the lamp device 14 includes lamp pin mounting portions 73 where the lamp pins are to be mounted and the insulating member 47 having an insulating portion 75 interposed between the inner surface of the cap portion 44 and the lighting circuit 21.
摘要翻译： 灯装置14包括使用半导体发光元件的发光部34。 发光部分34布置在壳体16的一个表面的侧面上。在壳体16的另一个表面侧设置有金属盖部分44和从另一个表面侧突出的灯销46 照明电路21存储在壳体16中。然后，灯装置14包括灯销安装部分73，其中灯销将被安装，并且绝缘部件47具有插入在内表面之间的绝缘部分 盖部44和点亮电路21。
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公开(公告)号：USD662479S1
公开(公告)日：2012-06-26
申请号：US29398861
申请日：2011-08-05
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