公开(公告)号：US20240399713A1

公开(公告)日：2024-12-05

申请号：US18802303

申请日：2024-08-13

Applicant: KANEKA CORPORATION

Inventor： Takahiro Sato ,  Keisuke Oguma

IPC: B32B15/08 ,  B32B7/12 ,  B32B37/12 ,  C08G73/10

Abstract: A polyamide acid including tetracarboxylic dianhydride residues and diamine residues is provided. The tetracarboxylic dianhydride residues include a 3,3′,4,4′-biphenyltetracarboxylic dianhydride residue and a 3,3′,4,4′-benzophenonetetracarboxylic dianhydride residue. The diamine residues include a p-phenylenediamine residue and a 1,3-bis(4-aminophenoxy)benzene residue. A multi-layered polyimide film includes a non-thermoplastic polyimide film and an adhesive layer containing a thermoplastic polyimide disposed on at least one surface of the non-thermoplastic polyimide film.

公开(公告)号：US20230265252A1

公开(公告)日：2023-08-24

申请号：US18137757

申请日：2023-04-21

Applicant: KANEKA CORPORATION

Inventor： Takahiro Sato ,  Seiji Hosogai ,  Mari Uno ,  Keisuke Oguma

IPC: C08J5/18 ,  C08G73/10

CPC classification number: C08J5/18 ,  C08G73/10 ,  C08J2379/08

Abstract: A non-thermoplastic polyimide film contains non-thermoplastic polyimide. The non-thermoplastic polyimide has a 3,3′,4,4′-biphenyltetracarboxylic dianhydride residue, a 4,4′-oxydiphthalic anhydride residue, a p-phenylenediamine residue and a 1,3-bis(4-aminophenoxy)benzene residue. Where the content ratio of the 3,3′,4,4′-biphenyltetracarboxylic dianhydride residue is A1 mol %, the content ratio of the 4,4′-oxydiphthalic anhydride residue is A2 mol %, the content ratio of the p-phenylenediamine residue is B1 mol %, and the content ratio of the 1,3-bis(4-aminophenoxy)benzene residue is B2 mol %, the relationships of A1+A2≥80, B1+B2≥80 and (A1+B1)/(A2+B2)≤3.50 are satisfied.