公开(公告)号：US20230323089A1

公开(公告)日：2023-10-12

申请号：US18334706

申请日：2023-06-14

Applicant: KANEKA NORTH AMERICA LLC

Inventor： Atsushi FUKUNAGA ,  Chin-Chang SHEN ,  Kenneth SUTHERLAND, JR. ,  Yu ITANO ,  Akira OGAWA

IPC: C08K7/14 ,  C08K3/40

CPC classification number: C08K7/14 ,  C08K3/40 ,  C08K2201/003 ,  C08K2201/016

Abstract: Provided is a curable composition having superior weather resistance which is obtained from a cured product containing a polyoxyalkylene polymer comprising a reactive silicon group. The curable composition contains (A) a reactive-silicon-group-containing polyoxyalkylene polymer having a number-average molecular weight of 2,000 to 50,000 and containing 1.1 to 5 reactive silicon groups within a single molecule, and (B) from 0.01 to 100 parts by weight of a powdered-glass-based filler based on 100 parts of the component (A).

公开(公告)号：US20170114209A1

公开(公告)日：2017-04-27

申请号：US15401571

申请日：2017-01-09

Applicant: KANEKA NORTH AMERICA LLC

Inventor： Atsushi FUKUNAGA ,  Chin-Chang SHEN ,  Kenneth SUTHERLAND, JR. ,  Yu ITANO ,  Akira OGAWA

IPC: C08K7/14

CPC classification number: C08K7/14 ,  C08K3/40 ,  C08K2201/003 ,  C08K2201/016 ,  C08L83/12

Abstract: Provided is a curable composition having superior weather resistance which is obtained from a cured product containing a polyoxyalkylene polymer comprising a reactive silicon group. The curable composition contains (A) a reactive-silicon-group-containing polyoxyalkylene polymer having a number-average molecular weight of 2,000 to 50,000 and containing 1.1 to 5 reactive silicon groups within a single molecule, and (B) from 0.01 to 100 parts by weight of a powdered-glass-based filler based on 100 parts of the component (A).

公开(公告)号：US20210024723A1

公开(公告)日：2021-01-28

申请号：US17066580

申请日：2020-10-09

Applicant: KANEKA NORTH AMERICA LLC

Inventor： Atsushi FUKUNAGA ,  Chin-Chang SHEN ,  Kenneth SUTHERLAND, JR. ,  Yu ITANO ,  Akira OGAWA

IPC: C08K7/14 ,  C08K3/40

Abstract: Provided is a curable composition having superior weather resistance which is obtained from a cured product containing a polyoxyalkylene polymer comprising a reactive silicon group. The curable composition contains (A) a reactive-silicon-group-containing polyoxyalkylene polymer having a number-average molecular weight of 2,000 to 50,000 and containing 1.1 to 5 reactive silicon groups within a single molecule, and (B) from 0.01 to 100 parts by weight of a powdered-glass-based filler based on 100 parts of the component (A).

公开(公告)号：US20160160010A1

公开(公告)日：2016-06-09

申请号：US14834240

申请日：2015-08-24

Applicant: Kaneka North America LLC

Inventor： Atsushi FUKUNAGA ,  Chin-Chang SHEN ,  Kenneth SUTHERLAND, JR. ,  Yu ITANO ,  Akira OGAWA

IPC: C08K7/14

CPC classification number: C08K7/14 ,  C08K3/40 ,  C08K2201/003 ,  C08K2201/016 ,  C08L83/12

Abstract: [Problem] To provide a curable composition of superior weather resistance, the composition being obtained using a cured product containing a polyoxyalkylene polymer comprising a reactive silicon group.[Solution] A curable composition containing (A) a reactive-silicon-group-containing polyoxyalkylene polymer having a number-average molecular weight of 2,000 to 50,000 and containing 1.1 to 5 reactive silicon groups within a single molecule, and (B) from 0.01 to 100 parts by weight of a powdered-glass-based filler.

Abstract translation: 为了提供耐候性优异的固化性组合物，使用含有含有活性硅基团的聚氧化烯聚合物的固化物得到的组合物。 [溶液]一种固化性组合物，其含有（A）数均分子量为2,000〜50,000的含反应性硅基的聚氧化烯聚合物，并且在单分子内含有1.1〜5个反应性硅基，和（B）0.01 至100重量份的粉状玻璃基填料。

公开(公告)号：US20190023876A1

公开(公告)日：2019-01-24

申请号：US16142117

申请日：2018-09-26

Applicant: KANEKA NORTH AMERICA LLC

Inventor： Atsushi FUKUNAGA ,  Chin-Chang SHEN ,  Kenneth SUTHERLAND, JR. ,  Yu ITANO ,  Akira OGAWA

IPC: C08K7/14 ,  C08K3/40 ,  C08L83/12

Abstract: Provided is a curable composition having superior weather resistance which is obtained from a cured product containing a polyoxyalkylene polymer comprising a reactive silicon group. The curable composition contains (A) a reactive-silicon-group-containing polyoxyalkylene polymer having a number-average molecular weight of 2,000 to 50,000 and containing 1.1 to 5 reactive silicon groups within a single molecule, and (B) from 0.01 to 100 parts by weight of a powdered-glass-based filler based on 100 parts of the component (A).