公开(公告)号：US20200009703A1

公开(公告)日：2020-01-09

申请号：US16416736

申请日：2019-05-20

Applicant: KCTECH CO., LTD.

Inventor： Jong-Tae JOO ,  Sang Hyun KIM ,  Ho Cheon JEONG ,  Jae Yeol KIM

IPC: B24B37/005 ,  B24B37/30

Abstract: The present invention relates to a substrate polishing system comprising a polishing pad covered on the polishing platen; a plurality of substrate carriers including a first substrate carrier which moves in a state in which a substrate is mounted and performs a polishing process in a state in which the substrate is in contact with the polishing pad on the polishing pad; a monitoring unit of displaying the information including the identity, position of at least one of the substrate carriers; and a control unit of outputting a warning signal and/or changes the operation of operating devices when an error occurs in real time thereby improving the monitoring efficiency and operation reliability of the polishing process of the substrate.