公开(公告)号：US20230065885A1

公开(公告)日：2023-03-02

申请号：US17671259

申请日：2022-02-14

Applicant: KCTECH CO., LTD.

Inventor： Hee Sung CHAE ,  Seung Eun LEE ,  Geun Sik YUN

IPC: B25J9/04 ,  B25J11/00 ,  B65G61/00

Abstract: A substrate cleaning line and a substrate cleaning system including the same are disclosed. The substrate cleaning line may include a chamber portion including a plurality of cleaning chambers to clean a substrate, and a first return robot to load, unload, or transfer the substrate from or to the plurality of cleaning chambers, wherein the cleaning chambers may be stacked on each other in a vertical direction.

公开(公告)号：US20220274228A1

公开(公告)日：2022-09-01

申请号：US17579189

申请日：2022-01-19

Applicant: KCTECH CO., LTD.

Inventor： Hee Sung CHAE ,  Seung Eun LEE ,  Geun Sik YUN

IPC: B24B37/10 ,  B24B37/30 ,  B24B37/34 ,  B24B57/02

Abstract: A substrate polishing system may include a substrate transfer unit to support a bottom surface of a substrate and transfer the substrate while forming a transfer orbit in a circle by a rotational motion, at least one carrier to perform polishing on the substrate received from the substrate transfer unit, and a loader to load the substrate which is seated on the substrate transfer unit to the carrier or unload a substrate placed on the carrier to the substrate transfer unit.

公开(公告)号：US20220111486A1

公开(公告)日：2022-04-14

申请号：US17495818

申请日：2021-10-07

Applicant: KCTECH CO., LTD.

Inventor： Hee Sung CHAE ,  Seung Eun LEE ,  Geun Sik YUN

IPC: B24B37/34 ,  B24B37/04 ,  B08B13/00 ,  B08B3/02

Abstract: A substrate processing system includes a front-end module, a first processing line including a first polishing line and a first cleaning line, a second processing line including a second polishing line and a second cleaning line and disposed in parallel to the first processing line, a first stage disposed between the first cleaning line and the second cleaning line, a first retransfer robot configured to transfer a substrate from the front-end module to the first stage, a second stage disposed between the first polishing line and the second polishing line, and a second retransfer robot configured to transfer the substrate between at least two locations of the first cleaning line, the second cleaning line, the first stage, and the second stage.

公开(公告)号：US20220111485A1

公开(公告)日：2022-04-14

申请号：US17495816

申请日：2021-10-07

Applicant: KCTECH CO., LTD.

Inventor： Hee Sung CHAE ,  Seung Eun LEE ,  Geun Sik YUN

IPC: B24B37/34 ,  B24B37/10 ,  B24B41/00 ,  B24B27/00

Abstract: A substrate processing system includes a front-end module, a first processing line including a first polishing line and a first cleaning line, a second processing line including a second polishing line and a second cleaning line and disposed in parallel to the first processing line, a first stage disposed between the first processing line and the second processing line, and a first retransfer robot configured to transfer a substrate from the front-end module to the first stage.