公开(公告)号：US11540409B2

公开(公告)日：2022-12-27

申请号：US17236285

申请日：2021-04-21

申请人： KEPCO ENGINEERING & CONSTRUCTION COMPANY, INC.

发明人： Ji Wung Park

IPC分类号： H05K5/06 ,  H01B17/30

摘要： The triple sealing device for an electronics housing of smart instrumentation includes: an electronic board; a first housing which has the electronic board disposed therein and includes a first inlet port to allow a cable to pass therethrough; a second housing which is provided above the first inlet port of the first housing and coupled to the first housing, and includes a second inlet port to allow a cable to pass therethrough; an elastic block provided on an inner circumferential surface of the second inlet port; and a cable which is connected to the electronic board and extends outward after passing through the first inlet port and the second inlet port.