公开(公告)号：US20220059316A1

公开(公告)日：2022-02-24

申请号：US17182192

申请日：2021-02-22

Applicant: KLA CORPORATION

Inventor： Santosh Bhattacharyya ,  Steve Esbenshade

IPC: H01J37/28 ,  H01J37/244 ,  G06T7/00

Abstract: A scanning electron microscope receives a results file for a wafer from an optical inspection system. The results file includes an anchor point on the wafer. A defect review image at the anchor point on the wafer is generated using the scanning electron microscope. A design clip is aligned to the defect review image at the anchor point thereby generating an aligned defect review image. The aligned defect review image is used for defect detection.