System and method for generation of wafer inspection critical areas

    公开(公告)号:US11410291B2

    公开(公告)日:2022-08-09

    申请号:US16921812

    申请日:2020-07-06

    申请人: KLA Corporation

    IPC分类号: G06T7/00 H01L21/66

    摘要: A method includes receiving one or more sets of wafer data, identifying one or more primitives from one or more shapes in one or more layers in the one or more sets of wafer data, classifying each of the one or more primitives as a particular primitive type, identifying one or more primitive characteristics for each of the one or more primitives, generating a primitive database of the one or more primitives, generating one or more rules based on the primitive database, receiving one or more sets of design data, applying the one or more rules to the one or more sets of design data to identify one or more critical areas, and generating one or more wafer inspection recipes including the one or more critical areas for an inspection sub-system.

    System and Method for Generation of Wafer Inspection Critical Areas

    公开(公告)号:US20200334807A1

    公开(公告)日:2020-10-22

    申请号:US16921812

    申请日:2020-07-06

    申请人: KLA Corporation

    IPC分类号: G06T7/00 H01L21/66

    摘要: A method includes receiving one or more sets of wafer data, identifying one or more primitives from one or more shapes in one or more layers in the one or more sets of wafer data, classifying each of the one or more primitives as a particular primitive type, identifying one or more primitive characteristics for each of the one or more primitives, generating a primitive database of the one or more primitives, generating one or more rules based on the primitive database, receiving one or more sets of design data, applying the one or more rules to the one or more sets of design data to identify one or more critical areas, and generating one or more wafer inspection recipes including the one or more critical areas for an inspection sub-system.