公开(公告)号：US12190498B2

公开(公告)日：2025-01-07

申请号：US18072605

申请日：2022-11-30

Applicant: KLA Corporation

Inventor： Nurmohammed Patwary ,  James A. Smith ,  Heonju Shin ,  Jusang Maeng ,  Kenong Wu ,  Xiaochun Li ,  Hucheng Lee

IPC: G06T7/00 ,  G06T5/50 ,  G06V10/74

Abstract: Systems and methods for detecting defects on a reticle are provided. One system is configured for generating different stacked difference images for multiple instances of first patterned areas in different rows on a wafer based on images generated for the first patterned areas in the different rows. The system is also configured for performing double detection based on the different stacked difference images. The system then identifies defects on the reticle based on the defects detected by the double detection. As described further herein, the systems and methods detect defects from multiple reticle rows printed on a wafer, which can reduce noise and enable detection of substantially small repeater defects. The embodiments are particularly useful for high sensitivity repeater defect detection for extreme ultraviolet (EUV) reticles and multi-die reticles (MDR).

公开(公告)号：US20240177294A1

公开(公告)日：2024-05-30

申请号：US18072605

申请日：2022-11-30

Applicant: KLA Corporation

Inventor： Nurmohammed Patwary ,  James A. Smith ,  Heonju Shin ,  Jusang Maeng ,  Kenong Wu ,  Xiaochun Li ,  Hucheng Lee

IPC: G06T7/00 ,  G06T5/50 ,  G06V10/74

CPC classification number: G06T7/001 ,  G06T5/50 ,  G06V10/761 ,  G06T2207/20221 ,  G06T2207/20224 ,  G06T2207/30148

Abstract: Systems and methods for detecting defects on a reticle are provided. One system is configured for generating different stacked difference images for multiple instances of first patterned areas in different rows on a wafer based on images generated for the first patterned areas in the different rows. The system is also configured for performing double detection based on the different stacked difference images. The system then identifies defects on the reticle based on the defects detected by the double detection. As described further herein, the systems and methods detect defects from multiple reticle rows printed on a wafer, which can reduce noise and enable detection of substantially small repeater defects. The embodiments are particularly useful for high sensitivity repeater defect detection for extreme ultraviolet (EUV) reticles and multi-die reticles (MDR).